Deformable Multi-Layer Microelectronic Device with Pivotable Sections
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Solution Overview
Problem
Conventional non-planar closed-loop electronic microstructures are structurally complex and costly to manufacture, requiring individual formation and mechanical coupling of flat microstructures, which complicates the production of non-planar devices for healthcare, medical, and communicational applications.
Innovation Solution
A deformable closed-loop multi-layered microelectronic device with pivotable sections in a top, middle, and bottom layer, connected through adhesive layers, allowing for synchronized deformation into three-dimensional configurations without additional aligning and joining processes, enabling the formation of non-planar structures like cone-shaped or cylindrical shapes directly from a flat geometry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional methods are used to manufacture non-planar closed-loop electronic microstructures by building and coupling numerous individual flat microstructures, then the non-planar structures can be formed, but the manufacturing process becomes structurally complex and costly
Solution Approach 1:
The patent divides the multi-layered structure into multiple flat layers (first layer, second layer, third layer) that can be manufactured separately using planar microlithography processes, then coupled together to form the final non-planar closed-loop structure. This segmentation allows complex 3D structures to be built from simpler 2D components.
Solution Approach 2:
The patent employs a nested structure where multiple flat layers are stacked and coupled together, with each layer containing patterned conductive traces and dielectric materials. The layers are nested vertically to form the complete multi-layered closed-loop device, enabling complex functionality within a compact structure.
2Shape
If individual flat microstructures are formed and mechanically coupled to create non-planar devices, then the desired three-dimensional shape is achieved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple manufacturing operations into integrated planar processes. Conductive traces, dielectric layers, and structural elements are all formed using the same microlithography and deposition techniques on the same substrate, eliminating the need for separate manufacturing and assembly steps for each component.
Solution Approach 2:
The patent performs preliminary formation of all structural elements, conductive patterns, and dielectric layers on flat substrates before final assembly. This allows all components to be prepared in advance using optimized planar processes, and the final non-planar structure is achieved through a single coupling operation rather than sequential assembly.
3Adaptability or versatility
If multiple layers of polymers are stacked and formed with patterned metal films for each flat microstructure, then the required electronic functionality is achieved, but the structural complexity and difficulty of coupling increase
Solution Approach 1:
The patent designs each layer to serve multiple functions simultaneously. For example, the first layer provides both structural support and electrical connectivity through its patterned conductive traces. The dielectric layers provide both electrical insulation and mechanical bonding between layers. This multi-functionality reduces the number of separate components needed and simplifies the overall coupling process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process by allowing the formation of complex non-planar structures from a flat geometry, reducing costs and complexity, and enabling the creation of devices like active lenses and drug delivery mechanisms with enhanced structural integrity and flexibility.
Implementation Method 1
The first pivot is connected to the first terminal end of the first section of the bottom layer through a first adhesive
Implementation Method 2
connected to the first terminal end of the first section of the top layer through a second adhesive
Data Source
AI summary
A deformable closed-loop multi-layered microelectronic device is provided. A top layer, a bottom layer and a middle layer of the microelectronic device each have at least a first section and a second section pivotable with respect to each other. A pivot is provided to a terminal end of the first section of the middle layer, for allowing the first section to rotate about the pivot. The pivot is vertically sandwiched between and connected to a terminal end of the first section of the top layer and a terminal end of the first section of the bottom layer. The first sections of the bottom layer and the top layer are pivotable in a substantially synchronized manner to deform the bottom layer and the top layer in a substantially synchronized manner.