Deformable Packing Insert for Wafer Stability

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Solution Overview

Problem

The existing methods for packing semiconductor wafers are inefficient, as they require additional inserts when shipping fewer wafers than designed, leading to increased material usage and costs, and can cause damage due to movement during transport.

Innovation Solution

A deformable packing insert comprising a ring with radially arranged members and void regions, which conforms to the container space and stabilizes disc-shaped objects by distributing force evenly, preventing slippage and minimizing contact damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If additional inserts are used to fill the container when shipping fewer wafers than designed for, then the container volume is filled and wafers are secured, but material usage and packing costs increase

Engineering Contradiction:

Improvewafer securityVSAvoidpacking material usage

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The packing insert employs a deformable contacting portion with radially arranged members that can dynamically adjust their configuration. The members are designed to flex and deform under compression forces, allowing the insert to adapt its shape and volume to match the actual number of wafers being shipped, eliminating the need for additional filler inserts.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The insert changes its physical parameters (shape, volume, density) through deformation of the contacting portion. By varying the compression level applied to the radially arranged members, the insert can adjust its effective volume to perfectly fill the container space regardless of the number of wafers, optimizing material usage.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If traditional rigid inserts are used to fill container volume, then the container is secured, but the inserts may move during shipping and cause wafer damage

Engineering Contradiction:

Improvecontainer securityVSAvoidwafer damage risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The contacting portion utilizes flexible structural elements that can deform and conform to movement forces. These flexible members absorb shipping vibrations and movements through elastic deformation, preventing the transmission of harmful forces to the wafers while maintaining container security.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The deformable contacting portion acts as a built-in cushioning system that is already in place before shipping. The flexible members are designed to deform under expected shipping conditions, providing beforehand protection against impacts and movements that could damage the wafers.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If the container is designed for a fixed number of wafers, then packing is simplified, but flexibility to accommodate varying shipment quantities is reduced

Engineering Contradiction:

Improvepacking process simplicityVSAvoidshipment quantity flexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The packing insert is designed as a universal solution that can accommodate multiple shipment quantities within the container's capacity. The deformable contacting portion with radially arranged members can adjust to different compression levels, allowing the same insert design to work for varying numbers of wafers, thus providing multi-functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The insert transitions from a static, fixed-configuration design to a dynamic, adaptable structure. The radially arranged members can flex and deform to match different wafer quantities, enabling the packing system to adapt to varying shipment requirements without requiring multiple specialized insert designs.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The deformable packing insert efficiently fills containers with varying numbers of wafers, reduces material costs, and ensures stable transport by distributing force over a large area, minimizing damage to sensitive wafers.

Implementation Method 1

at least one compressible packing insert for the support portion having a variable height between a pre-defined filler height and at least the container height

Methodology Applied

Scientific EffectCompression: Compression

Implementation Method 2

The contacting portion can comprise one or more solid portions extending from the circumference, where the solid portions defining a plurality of radially arranged members separated by plurality of void regions

Methodology Applied

Scientific EffectDeformation: Deformation

Data Source

PatentUS9382022B2Packing insert for disc-shaped objects

Publication Date: 2016.07.05 TEXAS INSTRUMENTS INC

AI summary

A packing insert for disc-shaped objects comprising a ring and a deformable contacting portion supported by the ring and extending from a circumference of the ring. The contacting portion can comprise one or more solid portions extending from the circumference. The solid portions can define a plurality of radially arranged members separated by a plurality of void regions, where the solid portions extending radially from a circumference of the ring.