Deformable PCB Layer Structure for Foldable Hinge Heat Isolation
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Solution Overview
Problem
Existing electronic devices with movable housings face challenges in maintaining electrical connectivity and heat dissipation across deformable printed circuit boards as they move relative to each other.
Innovation Solution
A deformable printed circuit board with a first conductive layer, a second conductive layer, and a heat dissipation layer, featuring conductive vias and non-conductive layers to ensure electrical isolation and efficient heat transfer between interconnected housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a deformable printed circuit board is used to connect movable housings, then flexibility and adaptability are improved, but electrical connectivity and heat dissipation reliability deteriorate
Solution Approach 1:
The printed circuit board is segmented into multiple layers (first conductive layer, second conductive layer, heat dissipation layer, non-conductive layer) with distinct functions. This segmentation allows each layer to independently perform its specific role - electrical conduction, heat dissipation, and electrical isolation - thereby maintaining reliability while enabling overall board flexibility through the deformable structure.
Solution Approach 2:
The patent employs a composite multi-layer structure combining conductive materials (for electrical layers), heat dissipation materials (for thermal management), and non-conductive materials (for electrical isolation). This composite approach allows the board to simultaneously achieve flexibility from the deformable structure while maintaining electrical and thermal performance through the specialized properties of each material layer.
2Reliability
If conductive vias extend through the printed circuit board, then electrical connectivity between layers is improved, but risk of electrical short circuit with heat dissipation layer increases
Solution Approach 1:
The non-conductive layer serves as an intermediary barrier between the conductive vias and the heat dissipation layer. This intermediate layer electrically isolates the vias from the heat dissipation layer, preventing short circuits while allowing the vias to maintain electrical connectivity between the first and second conductive layers.
Solution Approach 2:
The conductive vias are nested within openings of the heat dissipation layer, with the non-conductive layer positioned between them. This nested arrangement allows the vias to pass through the heat dissipation layer's openings without making electrical contact, maintaining both electrical connectivity and preventing short circuits through the layered nesting structure.
3Temperature
If heat dissipation layer is added to the printed circuit board, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation layer is designed to serve multiple functions: it dissipates heat from the printed circuit board, provides structural support as part of the multi-layer assembly, and works in conjunction with the non-conductive layer to prevent electrical short circuits. This multi-functionality allows thermal management improvement without proportionally increasing device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the existing multi-layer PCB structure by integrating the heat dissipation layer as one of the layers in the assembly. Rather than adding a separate, standalone heat dissipation component, it is combined with the electrical and structural layers, thereby improving thermal management while minimizing the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates reliable electrical connectivity and effective heat dissipation across movable housings, enhancing the functionality and performance of foldable electronic devices.
Implementation Method 1
the radiating layer may be configured to transfer at least a portion of the heat in the first housing to the second housing
Implementation Method 2
a non-conductive layer (or body or member of non-conductive material) at least partially disposed within the opening such that the radiating layer and the at least one conductive via are electrically disconnected
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
The electronic device according to an embodiment includes a first housing; a second housing; a hinge structure that moveably couples the first housing and the second housing; a first printed circuit board at least partially deformable by movement of the second housing relative to the first housing, and wherein the first printed circuit board includes a first conductive layer; a second conductive layer disposed on the first conductive layer; at least one conductive via extending from the first conductive layer to the second conductive layer; a radiating layer interposed between the first conductive layer and the second conductive layer and including an opening surrounding the at least one conductive via; a non-conductive layer at least partially disposed within the opening.