Deformable PCB Via Isolation for Hinge Heat Transfer
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Solution Overview
Problem
Existing electronic devices with movable housings face challenges in maintaining electrical connectivity and heat dissipation as they deform, leading to potential disconnection and inefficiencies in circuit boards.
Innovation Solution
A deformable printed circuit board with a conductive layer, a radiating layer, and a non-conductive layer that allows for electrical isolation and heat transfer between housings, featuring a conductive via and a hinge structure that enables movement while maintaining electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid printed circuit board is used to maintain electrical connectivity between movable housings, then electrical connection stability is improved, but the device cannot accommodate housing movement and deformation
Solution Approach 1:
The printed circuit board is designed with flexible portions that can deform dynamically to accommodate housing movement while maintaining electrical connectivity. The flexible PCB allows the device to transition between folded and unfolded states without compromising connection stability.
Solution Approach 2:
The patent employs a flexible printed circuit board instead of a rigid one, allowing the circuit board to bend and deform with the housing movement. This flexible film structure maintains electrical connections while adapting to changing geometric configurations.
2Adaptability or versatility
If the printed circuit board is made deformable to accommodate housing movement, then adaptability is improved, but electrical connectivity and heat dissipation performance deteriorate
Solution Approach 1:
The printed circuit board is segmented into rigid portions and flexible portions. The rigid portions maintain structural integrity for stable electrical connections, while the flexible portions accommodate housing deformation. This segmentation allows the board to deform without compromising connectivity.
Solution Approach 2:
The PCB combines rigid and flexible material properties in a composite structure. This allows the board to exhibit both deformability for housing movement accommodation and rigidity for maintaining stable electrical connections in specific regions.
3Reliability
If conductive vias are used to maintain electrical connectivity through the radiating layer, then electrical connection is improved, but electrical short circuit between conductive layers may occur
Solution Approach 1:
A non-conductive layer is introduced as an intermediary between the radiating layer and conductive vias. This intermediate layer electrically isolates the vias from the radiating layer, preventing short circuits while allowing the vias to maintain electrical connectivity through the board structure.
Solution Approach 2:
The non-conductive layer is nested within the opening of the radiating layer, creating a hierarchical structure where the via passes through the non-conductive layer which is itself positioned within the radiating layer opening. This nested arrangement ensures electrical isolation while maintaining connectivity.
4Temperature
If the radiating layer is made continuous for heat transfer, then heat dissipation is improved, but electrical isolation between conductive layers becomes difficult
Solution Approach 1:
The radiating layer includes openings that segment it into isolated portions. These openings allow conductive vias to pass through while the remaining radiating layer material continues to provide heat dissipation pathways. The segmentation enables both thermal conductivity and electrical isolation.
Solution Approach 2:
The radiating layer has different properties in different regions: continuous in areas for heat transfer and interrupted by openings in areas where electrical isolation is needed. This local variation in quality allows simultaneous optimization of heat dissipation and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable electrical connectivity and efficient heat dissipation across movable housings, enhancing the functionality and durability of electronic devices with deformable structures.
Implementation Method 1
the radiating layer may be configured to transfer at least a portion of the heat in the first housing to the second housing
Implementation Method 2
a non-conductive layer at least partially disposed within the opening such that the radiating layer and the at least one conductive via are electrically disconnected
Data Source
AI summary
The electronic device according to an embodiment includes a first housing; a second housing; a hinge structure that moveably couples the first housing and the second housing; a first printed circuit board at least partially deformable by movement of the second housing relative to the first housing, and wherein the first printed circuit board includes a first conductive layer; a second conductive layer disposed on the first conductive layer; at least one conductive via extending from the first conductive layer to the second conductive layer; a radiating layer interposed between the first conductive layer and the second conductive layer and including an opening surrounding the at least one conductive via; a non-conductive layer at least partially disposed within the opening.