Deformable Plasma Antenna Layout for Uniform Substrate Processing
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Solution Overview
Problem
Existing plasma processing antennas fail to achieve uniform plasma processing across the surface of substrates due to variations in plasma intensity caused by the shape and positioning of the antenna, leading to non-uniform film deposition and processing outcomes.
Innovation Solution
The antenna is designed to be adjustable in shape and height, with deformable coupling members and a lifting mechanism that allows for precise positioning and bending to maintain a consistent oxidizing or nitriding amount across measurement points, optimizing the plasma processing uniformity by varying the antenna's configuration based on the substrate's radial direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the antenna is fixed in shape and position, then the device complexity is reduced, but the plasma processing uniformity deteriorates due to variations in oxidizing amount across measurement points
Solution Approach 1:
The antenna employs a deformable structure with multiple antenna members that can be individually adjusted in height and position. This dynamic configuration allows the antenna to adapt its shape to compensate for variations in oxidizing amount across different measurement points on the substrate, achieving uniform plasma processing while maintaining manageable device complexity through modular adjustment mechanisms.
Solution Approach 2:
Different antenna members are positioned and shaped to provide locally optimized plasma distribution. Each antenna member can be independently adjusted to address specific local variations in oxidizing amount at different measurement points, ensuring that each region of the substrate receives the appropriate plasma intensity for uniform processing.
2Manufacturing precision
If the antenna members are increased in number and individually adjusted, then the plasma processing uniformity is improved, but the device complexity and ease of operation worsen
Solution Approach 1:
The antenna system incorporates automated or semi-automated adjustment mechanisms that enable dynamic reconfiguration of antenna member positions and heights. This reduces the operational burden on users while maintaining the ability to achieve uniform film thickness across the substrate through precise control of plasma distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures high uniformity of plasma processing and film thickness across the substrate surface, significantly improving the consistency of plasma treatment outcomes by maintaining a predetermined oxidizing or nitriding amount at each measurement point.
Implementation Method 1
antenna for inductively-coupled plasma
Data Source
AI summary
A method for adjusting the oxidation or nitriding amount in a substrate process within a process chamber is disclosed. It involves providing a process chamber with a housing, a susceptor for holding the substrate, and an antenna member extending radially from the susceptor's center towards its outer periphery. A process gas supply unit is placed between the housing's bottom exterior and the susceptor's upper surface. The antenna member's shape on the central axis and outer peripheral sides of the susceptor is determined based on the tendencies for the oxidizing amount to decrease and increase, respectively, with increasing distance from the housing's bottom inside. The antenna is deformed based on the determined shape to adjust the oxidation or nitriding amount of the substrate process.