Deformable Plate Substrate Bonding Apparatus for Distortion Control
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Solution Overview
Problem
The substrate bonding process in semiconductor manufacturing lacks reliability, particularly in achieving consistent and high-density bonding of stacked semiconductor chips, which affects the productivity and quality of semiconductor devices.
Innovation Solution
A substrate bonding apparatus is designed with deformable plates and pneumatic adjustors to symmetrically deform and bond substrates, allowing for independent control of adsorption forces on central and peripheral areas, ensuring precise and reliable bonding through controlled curvature and pressure adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding apparatus is used, then bonding process can be performed, but reliability of bonding process is insufficient
Solution Approach 1:
The bonding apparatus divides the substrate support into multiple independent bonding chucks (first bonding chuck and second bonding chuck), each capable of independent deformation control. This segmentation allows precise control over different regions of the substrates, improving bonding reliability while maintaining manageable system complexity through modular design.
Solution Approach 2:
The bonding chucks incorporate deformable plates that can dynamically change shape in response to pressure adjustments. The deformable plates transition from flat to curved states, enabling adaptive control of substrate curvature during the bonding process. This dynamic capability enhances bonding reliability by accommodating substrate variations without requiring overly complex rigid structures.
2Manufacturing precision
If substrates are bonded without deformation control, then bonding process is simple, but distortion defects occur
Solution Approach 1:
The apparatus controls substrate deformation by adjusting pressure parameters within the bonding chucks. By varying pressure levels, the deformable plates change curvature to match substrate requirements, ensuring consistent bonding without distortion. This parameter-based control achieves high manufacturing precision through relatively simple pressure adjustment mechanisms rather than complex mechanical deformation systems.
3Reliability
If independent adsorption force control is implemented, then bonding reliability improves, but device complexity increases
Solution Approach 1:
Each bonding chuck is divided into multiple pressure control regions that can be independently adjusted. This segmentation enables different adsorption forces to be applied to different areas of the substrate simultaneously, improving reliability through localized control while maintaining simple overall system architecture through repetitive modular units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances the reliability of the bonding process by reducing distortion defects and improving the consistency of substrate bonding, leading to increased productivity and quality in semiconductor device manufacturing.
Implementation Method 1
a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base
Implementation Method 2
The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure
Implementation Method 3
The first bonding chuck is configured to independently adjust an a first adsorption force to be applied to the first central area and the first peripheral area of the first substrate
Data Source
AI summary
A substrate bonding apparatus for bonding a first substrate to a second substrate includes: a first bonding chuck including: a first base; a first deformable plate provided on the first base to support the first substrate; and a first pneumatic adjustor configured to deform the first deformable plate by adjusting a first pressure in a first cavity formed between the first deformable plate and the first base; and a second bonding chuck including: a second base; a second deformable plate provided on the second base to support the second substrate; and a second pneumatic adjustor configured to deform the second deformable plate by adjusting a second pressure in a second cavity formed between the second deformable plate and the second base. The first deformable plate is deformed such that a first distance between the first base and the first deformable plate is varied based on the first pressure, and the second deformable plate is deformed such that a second distance between the second base the second deformable plate is varied based on the second pressure.