Deformable Potting Enclosure for Wearable Electronics

Solution Overview

Problem

Conventional potting processes for electrical components require pre-sized molds, limiting design flexibility and durability, and do not fully utilize the potential of modern epoxy resins, which can lead to premature failure under environmental hazards, especially in wearable technology applications.

Innovation Solution

A method using a deformable potting enclosure with a partially cured epoxy compound that undergoes a post-mold conformation process, allowing for complex shape formation and enhanced durability by incorporating a reinforcement layer and a releasing agent to prevent adhesion, enabling the creation of custom shapes suitable for wearable devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If pre-sized molds are used for potting electrical components, then the manufacturing process is simple and straightforward, but design flexibility is limited and durability is reduced

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoiddesign flexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical state parameter of the potting material by using a two-part epoxy system that transitions from liquid to solid through chemical reaction. This allows the material to be poured in a fluid state to conform to any mold cavity shape, then cures to a rigid solid that provides structural support and durability, eliminating the need for pre-sized rigid molds

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite system combining two different epoxy resins (Part A and Part B) that chemically react to form a unified potting material. This composite approach enables the material to exhibit both fluid properties during pouring and solid properties after curing, providing both design flexibility and structural durability

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If pre-sized molds are used for potting electrical components, then the manufacturing process is straightforward, but the durability of the enclosure is reduced

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidenclosure durability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the physical state parameter of the potting material by using a two-part epoxy system that transitions from liquid to solid through chemical reaction. This allows the material to be poured in a fluid state to conform to any mold cavity shape, then cures to a rigid solid that provides structural support and durability, eliminating the need for pre-sized rigid molds

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces a release agent as an intermediary substance between the mold cavity and the potting material. This release agent prevents the cured epoxy from bonding to the mold, allowing easy removal of the finished product while maintaining the integrity and durability of the enclosure

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If conventional potting processes are used, then manufacturing is simple, but resistance to environmental hazards is insufficient

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidresistance to environmental hazards

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent uses a composite system combining two different epoxy resins (Part A and Part B) that chemically react to form a unified potting material. This composite approach enables the material to exhibit both fluid properties during pouring and solid properties after curing, providing both design flexibility and structural durability

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the physical state parameter of the potting material by using a two-part epoxy system that transitions from liquid to solid through chemical reaction. This allows the material to be poured in a fluid state to conform to any mold cavity shape, then cures to a rigid solid that provides structural support and durability

Inventive Principle:

Principle #35Parameter changes

4Strength

If rigid enclosures are used for wearable devices, then structural support is provided, but adaptability to complex shapes is limited

Engineering Contradiction:

Improvestructural supportVSAvoidadaptability to complex shapes

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent changes the physical state parameter of the potting material by using a two-part epoxy system that transitions from liquid to solid through chemical reaction. This allows the material to be poured in a fluid state to conform to any mold cavity shape, then cures to a rigid solid that provides structural support and durability, eliminating the need for pre-sized rigid molds

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances durability and design flexibility, providing superior resistance to shock, moisture, and mechanical damage, ensuring the integrity of internal power supplies in wearable electronic devices.

Implementation Method 1

a deformable potting enclosure formed from a moldable potting material and subjected to a curing process

Methodology Applied

Scientific EffectCuring: Phase Change

Implementation Method 2

a deformable potting enclosure with a partially cured epoxy compound that undergoes a post-mold conformation process

Methodology Applied

Scientific EffectDeformation: Deformation

Data Source

PatentUS11738482B2Method of potting electrical components into complex finished forms

Publication Date: 2023.08.29 ARMSTRONG JACK

AI summary

A method for potting electrical components into complex finishing forms is presented. A releasing agent is added into a mold cavity. Next, an initial layer of potting compound is added into the mold cavity. A label layer is added into the initial layer of the potting compound. A set of electronic components is added over the label layer. An interstitial layer of potting compound is added over the set of electronic components. A reinforcement layer is added along the interstitial layer. A finishing layer of the potting compound is added over the reinforcement layer forming an uncured potted electronic product. The uncured potted electronic product is cured within the mold cavity in order to produce a cured potted electronic product. The cured potted electronic product is released from the negative mold using a releasing device.