Deformable Roller Lamination for AMOLED Substrate Flatness
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Solution Overview
Problem
The existing AMOLED lamination devices face issues with bubble formation due to uneven substrate flatness, leading to adverse lamination effects.
Innovation Solution
A lamination device with a deformable roller and a pressure detection system that adjusts the rolling dot pattern to match the substrate's surface, ensuring even pressure and reducing bubble occurrence, utilizing a piezoelectric deformable layer and capacitive sensors for accurate flatness information acquisition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a uniform-pressure roller is used to perform smoothing and bubble-removing operation, then the lamination process can be completed, but bubbles occur due to uneven pressures between the roller and the substrate surface
Solution Approach 1:
The roller surface is divided into multiple independent pressure control regions, each capable of adjusting its pressure locally to match the substrate's flatness variations in different areas, thereby eliminating bubbles while maintaining overall lamination quality
Solution Approach 2:
The roller transitions from a rigid uniform-pressure structure to a dynamic structure where each pressure control region can independently adjust its pressure in real-time based on substrate flatness information, enabling adaptive pressure distribution
2Adaptability or versatility
If the substrate surface has non-uniform flatness, then the substrate can be manufactured with varying characteristics, but uneven pressures occur between the roller and substrate surface
Solution Approach 1:
A sensor array detects the substrate's flatness information and feeds it back to the pressure control system, which then adjusts the pressure distribution across different regions of the roller to compensate for flatness variations, achieving uniform pressure contact
Solution Approach 2:
The pressure control regions independently adjust their pressure parameters based on detected flatness variations, transforming the pressure distribution to match the substrate's surface characteristics and eliminate uneven pressure contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces bubble formation and improves lamination quality by applying even force across the substrate, enhancing the overall lamination process.
Implementation Method 1
a deformable layer arranged on the first roller and capable of being deformed to change a rolling dot pattern at an outer circumferential surface of the first roller
Implementation Method 2
a pressure detection film arranged on an outer circumferential surface of the second roller, and configured to detect, when the second roller rolls on the surface of the substrate, a pressure between the second roller and the surface of the substrate
Data Source
AI summary
A lamination device and a lamination method for attaching a film layer onto a substrate are provided. The lamination device includes a platform configured to carry and deliver a substrate, a layer application member configured to apply the film layer onto a surface of the substrate, a first roller configured to roll on the substrate having the film layer to perform a smoothing and bubble-removing operation, a deformable layer arranged on the first roller and capable of being deformed to change a rolling dot pattern at an outer circumferential surface of the first roller, thereby to enable the rolling dot pattern to match the surface of the substrate, and an alignment mechanism configured to align the substrate with the first roller.