Deformable Spacer for Optoelectronic Component Encapsulation
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Solution Overview
Problem
Existing methods for producing optoelectronic components face challenges in achieving a good seal and reducing burr formation during encapsulation, particularly when using rigid spacers or film-assisted molding, which can be costly and inefficient.
Innovation Solution
The method employs a deformable spacer applied to the semiconductor chip's radiation passage surface, which is deformed to seal the cavity and encapsulated with a casting compound, eliminating the need for expensive films and reducing burr formation by using a dome-shaped, UV-cured spacer that can be precisely positioned and shaped.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid glass plate spacer is used during encapsulation, then the sealing of the tool cavity is achieved, but the adjustment and application difficulty increases and burr formation occurs
Solution Approach 1:
The patent applies a deformable spacer made of elastomeric material that can dynamically change its shape during the encapsulation process. The spacer is initially in a first configuration that allows easy insertion and positioning, then deforms to a second configuration when pressed by the tool to achieve sealing. This dynamic behavior resolves the contradiction by providing both ease of adjustment and reliable sealing.
Solution Approach 2:
The patent changes the physical parameters of the spacer by using material with specific elastomeric properties and controlling its temperature. The spacer material is selected to have appropriate hardness and elasticity values that enable it to deform under pressure while maintaining sealing contact. This parameter optimization allows the spacer to transition from an easy-to-apply state to an effective sealing state.
2Reliability
If film-assisted molding is used for encapsulation, then the sealing is improved, but the production cost increases due to expensive films
Solution Approach 1:
The patent replaces expensive reusable films with a cheap, single-use deformable spacer that is applied directly to the semiconductor chip. The spacer is made from cost-effective elastomeric material and is typically removed after one use, eliminating the need for expensive film materials and reducing overall production costs while maintaining sealing quality.
Solution Approach 2:
The deformable spacer acts as an intermediary element between the tool and the semiconductor chip during encapsulation. It provides the necessary sealing function without requiring expensive films, serving as a cost-effective mediator that transfers the sealing action from the tool to the workpiece while eliminating the need for costly film materials.
3Reliability
If a deformable spacer is used instead of rigid spacer, then the sealing is improved and burr formation is reduced, but the spacer application precision must be increased
Solution Approach 1:
The patent uses a deformable spacer made of elastomeric material that can flex and conform to the semiconductor chip surface. This flexibility compensates for minor positioning variations, reducing the stringency of positioning precision requirements while maintaining effective sealing. The spacer's ability to deform allows it to adapt to slight misalignments that would be problematic with rigid spacers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a cost-effective, efficient encapsulation method with reduced burr formation and increased usable area for the radiation passage surface, allowing for better optical coupling and improved adhesion, while ensuring only fully functional components are encapsulated with a spacer.
Implementation Method 1
The drop of liquid material is cured to form the deformable spacer. For example, the drop of the liquid material is formed by jetting on the radiation passage surface of the semiconductor chip. The drop of liquid material is preferably applied to the radiation passage surface of the semiconductor chip at a speed of between 5000 units per hour and 10000 units per hour inclusive. Preferably the drop of liquid material is cured by UV radiation.
Data Source
AI summary
A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing an optoelectronic semiconductor chip with a radiation passage surface on a connection carrier, applying a deformable spacer to the radiation passage surface of the semiconductor chip, inserting the connection carrier with the semiconductor chip into a cavity of a tool, deforming, by the tool, the deformable spacer and encapsulating the semiconductor chip with a casting compound.