Deformable Tank Fluid Supply for High-Flow Low-Particle Pulses

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Solution Overview

Problem

Conventional fluid supply mechanisms face limitations in increasing flow rates while minimizing particle generation, particularly in semiconductor manufacturing processes like ALD, due to constraints in valve Cv values and the generation of particles with piston-based configurations.

Innovation Solution

A fluid supply mechanism that utilizes a deformable tank with variable internal volume, controlled by deformation and valve timing, to supply fluid in a pulsed manner, incorporating pressure sensors and drive sources to manage fluid flow and prevent backflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a piston is used to compress material gas in a tank, then the flow rate of material gas can be increased, but particles are generated inside the tank

Engineering Contradiction:
Improveflow rate of material gasVSAvoidparticle generation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The invention removes the piston from the tank configuration and replaces it with an external compression mechanism. The tank becomes a simple storage vessel without internal moving parts, eliminating the source of particle generation while maintaining the ability to compress and supply gas at high flow rates through valve control.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces a compression mechanism that operates externally to the tank, using the tank as an intermediary storage device. Gas is compressed in a separate mechanism, then transferred to the tank for storage, and finally supplied through valve control. This separates the compression function from the storage function, eliminating particle generation in the tank.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If a secondary valve with high Cv value is used to increase material gas flow rate, then the flow rate can be increased, but the valve size and system complexity increase

Engineering Contradiction:
Improveflow rate of material gasVSAvoidvalve configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The invention performs gas compression in advance before the gas enters the tank. By pre-compressing the gas to the desired pressure and flow rate characteristics, the system can use a simpler, smaller valve for final delivery control rather than requiring a large Cv valve to handle low-pressure high-flow requirements.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high flow rates of fluid supply with reduced particle generation, maintaining consistent supply amounts and preventing backflow, suitable for semiconductor processes without requiring significant program changes.

Implementation Method 1

an internal volume of the tank changes due to deformation of the tank

Methodology Applied
Scientific EffectDeformation: Deformation

Data Source

PatentUS20260084128A1Fluid supply mechanism and fluid supply method
Publication Date: 2026.03.26 HORIBA STEC CO LTD
  • US20260084128A1 patent drawing
  • US20260084128A1 patent drawing
  • US20260084128A1 patent drawing

AI summary

A fluid supply mechanism 100 that repeats supply and stop of a fluid to a chamber CH, includes: a fluid supply path L1 communicating with the chamber CH; a tank T provided in the fluid supply path L1 and into which the fluid is introduced; and a downstream-side valve Vd provided at a downstream side of the tank T in the fluid supply path L1, in which an internal volume of the tank T changes due to deformation of the tank T.