Elastically Deformable Temperature Sensor for Substrate Processing

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Solution Overview

Problem

Existing substrate processing technologies face challenges in accurately measuring low temperatures of silicon substrates due to increased wavelength transmission and varying emissivity, and contact temperature measurement methods suffer from reduced sensitivity and thermal interference from support members.

Innovation Solution

A substrate processing apparatus with an elastically deformable temperature sensor whose leading end protrudes from the mounting surface, allowing it to make contact with the substrate and provide accurate temperature measurements regardless of film formation states, using a sheath thermocouple with a heat-resistant metal pipe and a fine diameter to minimize heat capacity and enhance transient response.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a non-contact temperature measuring method using a radiation thermometer is used, then temperature measurement can be performed without contact, but accurate measurement of low temperature range is difficult due to increased wavelength transmission through silicon substrate

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidwavelength transmission through substrate

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

A transparent heat-resistant plate is introduced as an intermediary between the radiation thermometer and the silicon substrate. This plate has low wavelength transmission in the measurement wavelength range, preventing the harmful transmission effect while allowing thermal radiation to pass through for temperature measurement. The plate is positioned closer to the substrate than the thermometer, creating a stable measurement environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention replaces the direct optical measurement path (radiation thermometer directly viewing substrate) with a mediated path through the heat-resistant plate. This substitution eliminates the problematic wavelength transmission through silicon while maintaining non-contact measurement capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If a contact temperature measuring method using a thermocouple embedded in a support member is used, then direct temperature measurement is possible, but measurement sensitivity deteriorates and thermal interference occurs due to the support member

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidthermal effect from support member

Core Design Contradiction:

Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

The harmful support member (ceramic plate with thermocouple) is completely removed from the measurement system. Instead, a transparent heat-resistant plate without embedded sensors is used, eliminating the thermal interference and heat capacity issues while maintaining measurement capability through non-contact radiation detection.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The transparent heat-resistant plate serves as a mediator that enables contactless measurement proximity without the harmful thermal effects of embedded thermocouples. It provides a stable platform for accurate radiation-based temperature measurement.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If a radiation thermometer of short wavelength is used to reduce transmission amount, then wavelength transmission is reduced, but accurate low temperature measurement remains difficult

Engineering Contradiction:

Improvewavelength transmission through substrateVSAvoidlow temperature measurement accuracy

Core Design Contradiction:

Object-affected harmful factorsVSMeasurement precision

Solution Approach 1:

The transparent heat-resistant plate acts as a wavelength-selective intermediary that blocks transmission in problematic wavelength ranges while allowing measurement wavelengths to pass. This enables the use of radiation thermometers at various wavelengths without suffering from substrate transmission effects.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves high accuracy in temperature measurement, comparable to traditional methods, while avoiding thermal interference and film state variations, with improved sensitivity and reduced heat capacity for precise temperature control.

Implementation Method 1

an elastically deformable temperature sensor whose leading end portion constitutes a temperature detection part

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heater configured to heat the substrate mounted on the mounting surface

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS11424146B2Substrate processing apparatus and temperature measurement unit

Publication Date: 2022.08.23 KOKUSAI DENKI KK

AI summary

There is provided a technique capable of easily improving accuracy of temperature measurement of a substrate, regardless of a film formation state of the substrate. There is provided a substrate processing apparatus including a substrate mounting table having a mounting surface on which a substrate is mounted, a heater configured to heat the substrate mounted on the mounting surface, and an elastically deformable temperature sensor whose leading end portion constitutes a temperature detection part. The temperature sensor is configured to extend from below the mounting surface to above the mounting surface, and the leading end portion protrudes from the mounting surface.