Deformable Vacuum Seal for Semiconductor Singulation
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Solution Overview
Problem
Existing singulation processes for semiconductor substrates are prone to vacuum leaks and substrate movement during cutting due to warpage or flex, leading to defective products, as they rely on firm fixation which is not always guaranteed.
Innovation Solution
A singulation apparatus with a deformable portion on the carrier that conforms to the substrate's surface, forming a secure vacuum seal around vacuum holes to immobilize the substrate during the singulation process, using materials like fluoroelastomer or silicone, and optionally a chuck for additional support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a firm fixation method is used to prevent substrate movement during cutting, then manufacturing precision is improved, but device complexity increases due to additional fixation mechanisms
Solution Approach 1:
The patent replaces complex mechanical fixation systems with a vacuum-based suction mechanism. The carrier uses vacuum holes to create negative pressure that holds the semiconductor substrate in place during singulation, eliminating the need for mechanical clamps, screws, or other complex fixation devices while maintaining precise substrate positioning.
Solution Approach 2:
The patent employs a vacuum (pneumatic) system to fixate the substrate. Vacuum holes in the carrier create negative pressure that securely holds the substrate without requiring complex mechanical structures. This pneumatic approach simplifies the fixation mechanism while ensuring precise substrate positioning during the cutting process.
2Ease of operation
If vacuum fixation is used to hold the substrate, then ease of operation is improved, but reliability deteriorates due to vacuum leaks from substrate warpage or flex
Solution Approach 1:
The patent incorporates a flexible seal member (such as an O-ring or gasket) around the substrate perimeter on the carrier. This flexible element compensates for substrate warpage or flex during cutting by adapting to the substrate's shape changes, maintaining the vacuum seal integrity and preventing leaks that would compromise fixation reliability.
Solution Approach 2:
The patent uses a deformable portion on the carrier that can change its physical state or geometry in response to substrate warpage. This deformable element adjusts its shape or compliance to maintain contact with the substrate surface, ensuring the vacuum seal remains effective even when the substrate flexes or warps during the singulation process.
3Device complexity
If traditional fixation methods are used, then device complexity is reduced, but manufacturing precision deteriorates due to substrate movement during cutting
Solution Approach 1:
The patent replaces complex mechanical fixation systems with a vacuum-based suction mechanism. The carrier uses vacuum holes to create negative pressure that holds the semiconductor substrate in place during singulation, eliminating the need for mechanical clamps, screws, or other complex fixation devices while maintaining precise substrate positioning.
Solution Approach 2:
The patent employs a vacuum (pneumatic) system to fixate the substrate. Vacuum holes in the carrier create negative pressure that securely holds the substrate without requiring complex mechanical structures. This pneumatic approach simplifies the fixation mechanism while ensuring precise substrate positioning during the cutting process.
4Ease of operation
If vacuum holes are added to the carrier for substrate fixation, then ease of operation is improved, but device complexity increases due to additional carrier components
Solution Approach 1:
The carrier is designed with multi-functionality: it provides structural support for the substrate, contains integrated vacuum holes for fixation, and includes deformable portions for seal compensation. By combining these functions into a single integrated component rather than separate parts, the overall device complexity is reduced while maintaining ease of substrate handling and secure fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents vacuum leaks and ensures secure attachment of warped substrates, maintaining the integrity of semiconductor devices during singulation, reducing defects and improving process reliability.
Implementation Method 1
A semiconductor substrate is placed on a top surface of the carrier. The carrier has a number of vacuum holes and a deformable portion. Each singulation site includes a deformable portion and at least one vacuum hole.
Implementation Method 2
The deformable portion forms a seal around the carrier's vacuum holes when a vacuum force is introduced in the vacuum hole. The singulation apparatus is also suitable for a warped semiconductor substrate since its deformable portion is deformed in conformance with the warped semiconductor substrate surface
Data Source
AI summary
A singulation apparatus includes a carrier having a plurality of singulation sites and a scribe line between each of the plurality of singulation sites and an adjacent singulation site. The carrier has a top surface configured to receive a semiconductor substrate thereon. Each of the plurality of singulation sites includes a deformable portion and at least one vacuum hole. The at least one vacuum hole and the deformable portion is configured to form a seal around the at least one vacuum holes when a force is applied. The present disclosure further includes a method of manufacturing semiconductor devices, especially for a singulation process.