Deformed Layer Component Carrier Accommodating Varying Heights
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Solution Overview
Problem
The challenge lies in efficiently embedding components with varying sizes and shapes into component carriers, particularly in creating accommodation volumes that can accommodate components of different heights and ensuring reliable electrical connectivity while maintaining mechanical robustness and compactness.
Innovation Solution
A method involving a deformable layer that is thermo-formed to create accommodation volumes, allowing for precise shaping and accommodation of components, with the option to use materials like epoxy resin or polyimide, which can be thermo-deformed to define these volumes and provide both mechanical support and electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a planar component carrier structure is used, then manufacturing is simple, but accommodation of components with varying heights and shapes is inefficient
Solution Approach 1:
The patent transitions from a planar (2D) component carrier structure to a three-dimensional structure by deforming a layer to create accommodation volumes with varying depths. This dimensional change enables efficient accommodation of components with different heights and shapes while maintaining structural integrity through the deformed layer configuration.
2Adaptability or versatility
If components are embedded in deep cavities, then accommodation flexibility is improved, but electrical connectivity becomes difficult to establish
Solution Approach 1:
The patent segments the component carrier into multiple functional layers including a deformable layer that forms accommodation volumes, an intermediate layer, and a top layer. This segmentation allows deep cavities to be created for component accommodation while maintaining separate pathways for electrical connectivity through the layered structure, solving the connectivity issue without compromising accommodation flexibility.
3Strength
If a rigid structure is used, then mechanical robustness is maintained, but warpage occurs under thermal and mechanical loads
Solution Approach 1:
The patent applies local quality by creating a deformed layer with spatially varying properties - the layer is deformed to different extents in different regions to form accommodation volumes of varying depths. This localized deformation allows the structure to accommodate different components while distributing thermal and mechanical stresses more evenly, reducing warpage while maintaining overall mechanical robustness.
4Productivity
If components are placed close together, then space utilization is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements preliminary action by pre-forming the deformable layer into the desired three-dimensional configuration with accommodation volumes before component placement. This pre-configuration provides precise mechanical guides and positioning features that facilitate accurate component placement, reducing manufacturing precision requirements while enabling high-density component arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-density, compact component carriers with efficient electrical connectivity and mechanical robustness, allowing for flexible coupling architectures and precise component placement, reducing warpage and improving thermal performance.
Implementation Method 1
A method involving a deformable layer that is thermo-formed to create accommodation volumes, allowing for precise shaping and accommodation of components
Data Source
AI summary
A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a deformed layer connected to and/or forming part of the stack and being bent so as to define accommodation volumes for components, and the components, wherein each of the components is accommodated in a respective one of the accommodation volumes.