Deformed Mesh Thermal Ground Plane Vapor Liquid Channels
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Solution Overview
Problem
The increasing heat dissipation requirements and heat generation density in miniaturized electronic devices pose a challenge in effectively managing thermal management in advanced electronic systems.
Innovation Solution
A thermal ground plane is designed comprising a first and second casing layer bonded at their outer peripheries, with a working fluid enclosed within. This design includes a permeable wick and a deformed mesh with vapor and liquid channels, enhancing thermal conductivity and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are miniaturized to increase integration, then device size is reduced, but heat generation density increases
Solution Approach 1:
The thermal ground plane is segmented into multiple functional layers including a wick layer, vapor chamber, and deformed mesh structure. This segmentation allows each layer to perform specific thermal functions (capillary transport, phase change, heat distribution) thereby managing high heat density in a compact form factor
Solution Approach 2:
The invention utilizes phase transition of the working fluid between liquid and vapor states within the deformed mesh structure. Liquid absorbs heat through evaporation in high heat density regions and vapor releases heat through condensation in lower heat density regions, enabling effective thermal management in miniaturized devices
2Reliability
If a deformed mesh structure is introduced to enhance heat transfer, then thermal conductivity is improved, but device complexity increases
Solution Approach 1:
The deformed mesh creates a porous structure with controlled pore sizes that enhances capillary action and surface area for phase change. This porous architecture improves thermal conductivity and heat transfer efficiency while maintaining a relatively simple overall device structure through a single integrated ground plane component
Solution Approach 2:
The mesh is deformed from a flat two-dimensional structure into a three-dimensional configuration with varying pore sizes and depths. This dimensional transformation creates vapor and liquid channels that enhance heat transfer pathways without significantly increasing the device's external footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal ground plane achieves high effective thermal conductivity with low temperature gradients, effectively managing heat transfer through convection and capillary forces, thereby addressing the thermal challenges in miniaturized electronic devices.
Implementation Method 1
deformed mesh portions that form vapor channels
Implementation Method 2
nondeformed mesh portions that form liquid channels
Implementation Method 3
a permeable wick disposed between the first casing layer and the second casing layer
Implementation Method 4
A working fluid may be disposed within the first casing layer and the second casing layer
Data Source
AI summary
Some embodiments include a thermal ground plane comprising a first casing layer and a second casing layer where the outer periphery of the first casing layer and the outer periphery of the second casing layer are bonded to each other. The thermal ground plane including a working fluid disposed within the first casing layer and the second casing layer. The thermal ground plane may also include a permeable wick disposed between the first casing layer and the second casing layer; and a deformed mesh disposed between the first casing layer and the permeable wick, the deformed mesh comprising a mesh with deformed mesh portions that form vapor channels and nondeformed mesh portions that form liquid channels.