Deformed Substrate Handling Apparatus with Sensor-Actuator Control
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Solution Overview
Problem
Deformed substrates, such as wafers, pose challenges in semiconductor processing due to non-uniform deformation causing issues with film deposition, polishing, and lithographic exposure, as existing vacuum chucks and clamps struggle to securely hold warped substrates.
Innovation Solution
A substrate handling apparatus equipped with sensors to detect deformity and apply controlled force to maintain substrates flat on a support, using actuators and flexible retention portions to minimize damage and ensure secure vacuum pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pressure is applied to pull deformed substrate down against the chuck, then substrate contact with chuck is improved, but substrate deformation remains when deformation exceeds vacuum pressure capability
Solution Approach 1:
The apparatus applies a preliminary force to the top surface of the substrate before or during vacuum chuck engagement to proactively flatten the substrate. This preliminary action prevents the substrate from remaining deformed, ensuring it makes adequate contact with the chuck surface for reliable vacuum retention.
Solution Approach 2:
A force application mechanism acts as an intermediary between the vacuum chuck and the deformed substrate. This intermediary applies controlled force to the top surface to flatten the substrate, enabling the vacuum chuck to effectively retain the substrate without direct mechanical contact during the flattening process.
2Manufacturing precision
If force is applied to flatten deformed substrate, then substrate flatness is improved, but substrate damage may occur if force is too great
Solution Approach 1:
The system dynamically adjusts the magnitude of the applied force based on the detected substrate deformation characteristics. By changing the force parameter to match the actual deformation level, the system achieves adequate flattening while preventing excessive force that could damage the substrate or its structures.
Solution Approach 2:
A sensor detects substrate deformation and provides feedback to the control system, which then adjusts the force application accordingly. This closed-loop feedback ensures the applied force is sufficient to flatten the substrate but not excessive to cause damage.
3Measurement precision
If manual inspection of substrate deformity is performed, then processing decisions can be made, but operator time and productivity are reduced
Solution Approach 1:
The system replaces manual visual inspection with an automated sensor-based detection system. The sensor objectively measures substrate deformation, and the control system automatically decides whether force application is needed, eliminating manual inspection while maintaining detection accuracy and improving throughput.
Solution Approach 2:
The substrate processing system performs its own inspection and decision-making through integrated sensors and control logic. The system automatically detects deformation, determines the appropriate response, and executes force application without external operator intervention, making the process self-sufficient and productive.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform processing of deformed substrates by ensuring consistent contact and preventing damage, enhancing production yield by maintaining substrate flatness during semiconductor device manufacturing.
Implementation Method 1
a sensor to detect the presence of substrate deformity
Implementation Method 2
a substrate handling apparatus applies force to the substrate that is great enough to deflect the substrate toward the support
Implementation Method 3
vacuum pressure drawn through an array of holes in the surface of the chuck
Data Source
AI summary
A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is herein disclosed. A sensor detects deformity, then the substrate is flattened, allowing a support to hold it securely.