Degassed Insulating Liquid Cooling for Pulsed Power Electronics
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Solution Overview
Problem
High power, high voltage pulsed power supplies for plasma processing face challenges in maintaining small dimensions while ensuring reliable insulation and cooling due to high voltage and current rise slopes, leading to unpredictable failures from gas bubble formation in cooling liquids.
Innovation Solution
An electronic device with an enclosed electrically insulating heat transfer liquid that is degassed before operation, using a degassing unit with a porous membrane and vacuum source to prevent gas contact, and a liquid guiding system for parallel cooling to maintain component temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If direct contact cooling with fluorinated liquids is used, then heat transfer efficiency is improved, but reliability deteriorates due to random failures from gas bubble formation
Solution Approach 1:
The cooling liquid is degassed before being introduced into the housing to remove dissolved gases that would form bubbles during operation. This preliminary action prevents the reliability issues caused by gas bubble formation while maintaining the excellent heat transfer properties of fluorinated liquids
Solution Approach 2:
The housing is filled with an inert gas atmosphere (such as nitrogen or dry air with controlled humidity) to prevent gas exchange between the cooling liquid and external environment. This creates a stable, bubble-free environment that maintains both heat transfer efficiency and operational reliability
2Volume of moving object
If electrical components are packed close together to reduce dimensions, then device size is reduced, but insulation performance deteriorates due to high voltage requirements
Solution Approach 1:
The fluorinated cooling liquid serves as an intermediary medium that provides both thermal coupling between components and electrical insulation between high-voltage elements. This dual-function medium enables close component packing while maintaining adequate insulation performance
Solution Approach 2:
The system uses a composite approach combining the electrical insulation properties of fluorinated liquids with the thermal conductivity needed for cooling. This composite solution allows compact component arrangement while meeting both insulation and cooling requirements
3Ease of operation
If cooling liquid is exposed to extraneous gas during operation, then gas exchange occurs, but bubble formation increases leading to failures
Solution Approach 1:
The housing is sealed and filled with an inert gas atmosphere that prevents gas exchange with the cooling liquid. This eliminates bubble formation from gas dissolution while allowing continuous liquid circulation for cooling
Solution Approach 2:
Dissolved gases are extracted from the cooling liquid through degassing before it enters the housing. This removal of harmful gases prevents bubble formation during operation while maintaining effective heat transfer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances reliability and stability by reducing bubble formation and electrostatic discharges, ensuring effective heat transfer and voltage balancing in high power, high voltage pulsed power supplies.
Implementation Method 1
an electrically insulating heat transfer liquid, filled within the container and having direct contact to the plurality of electrical components and configured to transport heat away from the plurality of electrical components
Implementation Method 2
the electrically insulating heat transfer liquid is degassed before a start of operation
Data Source
AI summary
An electronic device for a high power, high voltage pulsed power supply for biasing a substrate in a plasma process, the electronic device including a plurality of electrical components configured to generate heat when the device is in use, a container, wherein at least a part of the plurality of electrical components are placed in the container, and an electrically insulating heat transfer liquid, filled within the container and having direct contact to the plurality of electrical components and configured to transport heat away from the plurality of electrical components. The electrically insulating heat transfer liquid is enclosed in the container so that the electrically insulating heat transfer liquid has no contact with extraneous gas outside the container in operation of the electronic device and wherein the electrically insulating heat transfer liquid is degassed before a start of operation.


