Degassing Chamber Light Source Heating Uniformity

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Solution Overview

Problem

In semiconductor manufacturing, the degassing process for substrates in conventional degassing heating systems results in uncontrollable and inconsistent temperature due to the substrate container being deviated from the heat source during transfer, affecting the consistency and stability of subsequent process results.

Innovation Solution

A degassing chamber with a heating component comprising a first and second light source component located in upper and lower regions relative to the substrate transferring opening, ensuring uniform heating of substrates throughout the degassing and transferring processes by maintaining heat energy within reflection tubes and utilizing conductive rings for efficient power supply.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the substrate container is moved vertically for substrate transfer, then substrate transfer efficiency is improved, but temperature uniformity deteriorates due to deviation from the light source

Engineering Contradiction:
Improvesubstrate transfer efficiencyVSAvoidtemperature uniformity
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent transitions from a single light source positioned above the substrate container to a three-dimensional arrangement with light sources positioned at multiple locations including above, below, and at the sides of the substrate container. This spatial distribution ensures that substrates receive uniform heating radiation regardless of the container's vertical position during transfer operations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple light sources into a unified heating system that works协同ly. The first light source component is positioned in the first chamber above the substrate container, while the second light source component is positioned in the second chamber below the substrate container. Both components work together to provide comprehensive heating coverage, ensuring temperature uniformity even when the container moves vertically for substrate transfer.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of operation

If the substrate container is deviated from the light source during transfer, then substrate transfer is enabled, but heating consistency deteriorates

Engineering Contradiction:
Improvesubstrate transfer capabilityVSAvoidheating consistency
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent applies different heating strategies to different spatial zones. The first light source component positioned in the first chamber provides heating from above, while the second light source component positioned in the second chamber provides heating from below. This localized heating approach ensures that substrates at different positions within the container receive appropriate heating, maintaining heating consistency during transfer operations.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

By adding light sources in multiple spatial dimensions (above, below, and at sides of the substrate container), the system ensures that heating coverage is maintained regardless of the container's vertical position. This multi-dimensional lighting arrangement decouples the heating function from the container's vertical position, enabling easy substrate transfer while maintaining heating consistency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If a single light source is used above the substrate container, then device complexity is reduced, but temperature distribution uniformity deteriorates during substrate transfer

Engineering Contradiction:
Improveheating system complexityVSAvoidtemperature distribution uniformity
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent adds light sources in multiple spatial dimensions rather than simply increasing the number of light sources in a single plane. The first light source component is positioned in the first chamber above the substrate container, while the second light source component is positioned in the second chamber below the substrate container. This three-dimensional arrangement improves temperature distribution uniformity during substrate transfer while keeping the device structure relatively simple by utilizing the existing chamber configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heating system is designed to perform multiple functions: heating substrates during degassing, maintaining temperature during transfer, and ensuring uniform temperature distribution across all substrate positions. The first and second light source components work together to provide comprehensive heating coverage for various operational modes, making the system universally applicable to different process requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures uniform process temperatures and improved substrate quality by maintaining consistent heating across the substrate container's movement, enhancing the efficiency and consistency of the degassing process.

Implementation Method 1

The first light source component and the second light source component are provided for heating a substrate in the substrate container

Methodology Applied
Scientific EffectLight heating: Light

Implementation Method 2

utilizing conductive rings for efficient power supply

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11328940B2Degassing chamber and semiconductor processing apparatus
Publication Date: 2022.05.10 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
  • US11328940B2 patent drawing
  • US11328940B2 patent drawing
  • US11328940B2 patent drawing

AI summary

A degassing chamber and a semiconductor processing apparatus are provided. The degassing chamber includes a chamber; a substrate container, movable within the chamber in a vertical direction; and a heating component, disposed within the chamber. A substrate transferring opening is formed through a sidewall of the chamber for transferring substrates into or out of the chamber. The heating component includes a first light source component and a second light source component. The chamber is divided into a first chamber and a second chamber by the substrate transferring opening. The first light source component is located in the first chamber, and the second light source component is located in the second chamber. The first light source component and the second light source component are provided for heating a substrate in the substrate container.