Degating Device Cooling Pipe Airflow Temperature Control
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Solution Overview
Problem
The challenge in the IC chip manufacturing process is to quickly and uniformly cool down the temperature of the cull (runner, gate, and residue regions) after the molding process, as high temperatures hinder successful degating and can cause substrate warping during the degating process.
Innovation Solution
A degating device comprising an upper and lower mold, a blowing-opening for airflow to cool the cull, and a cooling pipe to maintain airflow temperature, allowing for efficient temperature reduction and cull removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If airflow is blown through the blowing-opening to cool the cull, then the compound temperature is lowered, but the blowing-opening temperature rises over time reducing cooling efficiency
Solution Approach 1:
The patent applies parameter changes by introducing a cooling pipe that changes the temperature parameter of the airflow itself. The cooling pipe cools the airflow before it enters the blowing-opening, ensuring the airflow maintains its cooling capability over time. This resolves the contradiction by dynamically adjusting the airflow temperature parameter to compensate for the heating effect of prolonged operation.
2Productivity
If the cull is not cooled down quickly, then the degating process can be proceeded, but the gate regions remain on the die substrates and substrate warping occurs
Solution Approach 1:
The patent applies preliminary action by cooling the airflow in advance through the cooling pipe before it reaches the blowing-opening. This pre-cooling ensures that the airflow maintains optimal cooling temperature throughout the degating process, enabling both rapid cooling and consistent cooling effectiveness. The cooling action is performed beforehand to prevent temperature rise that would compromise cooling efficiency during the actual degating operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively lowers the compound temperature, facilitating successful degating and preventing substrate warping by ensuring uniform cooling and maintaining airflow effectiveness over time.
Implementation Method 1
The cooling pipe is disposed according to the position of the blowing-opening, and can be disposed inside the upper mold or the lower mold for cooling down the temperature of the blowing-opening
Implementation Method 2
The airflow is blown out from the blowing-opening to lower the temperature around the chip carriers
Data Source
AI summary
A degating device applied to remove a cull between two chip carriers comprises a lower mold, an upper mold, a blowing-opening, and a cooling pipe. The lower mold is used to load chip carriers and has a plunger set for propping and degating the cull. The upper mold is fit in with the lower mold tightly. The airflow blown out from the blowing-opening blows to lower the temperature around the chip carriers. The cooling pipe is disposed according to the position of the blowing-opening to cool down the temperature around the blowing-opening. The two chip carriers are disposed on the lower mold and fixed between the upper mold and the lower mold while the upper mold combines with the lower mold. By changing the position of the plunger set relative to the upper mold and the lower mold, the cull can be stripped from the chip carriers.