Deionized Water Conditioning for Semiconductor Post-Electrofill
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Solution Overview
Problem
Current post-electrofill processing in semiconductor fabrication is hindered by slow throughput and excessive use of solvents and reagents, particularly in the etching and rinsing steps using deionized water, which is costly and time-consuming.
Innovation Solution
A conditioning system for deionized water that includes a degassing station to remove dissolved gases and a heating station to heat the water, optimizing its use in post-electrofill processes by maintaining a consistent temperature and pressure, thereby improving the efficiency of etching, rinsing, and drying processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deionized water is used for post-electrofill etching and rinsing, then cleaning effectiveness is improved, but processing time increases and throughput decreases
Solution Approach 1:
The patent applies parameter changes by heating the deionized water to elevated temperatures (typically 40-80°C) before using it for etching and rinsing operations. This temperature parameter change accelerates the etching reaction rates and improves rinsing efficiency, thereby reducing processing time while maintaining cleaning effectiveness. The heated water enables faster metal removal and more efficient particle removal without compromising the quality of cleaning.
2Reliability
If deionized water is used for post-electrofill processing, then reagent efficiency is improved, but solvent consumption increases
Solution Approach 1:
The patent utilizes parameter changes by heating deionized water to elevate its temperature before use in post-electrofill processing. This thermal parameter change enhances the efficiency of reagents and solvents by improving their reaction rates and cleaning capabilities. The heated water allows for reduced solvent consumption as the same volume of water provides more effective cleaning and etching performance at higher temperatures, thereby reducing overall solvent requirements.
Solution Approach 2:
The patent implements continuity of useful action by establishing a recirculation system where heated deionized water is continuously circulated through the post-electrofill processing equipment. Instead of using fresh water for each step, the system maintains a continuous loop of pre-heated water, improving reagent efficiency while reducing total solvent consumption. The recirculation ensures consistent temperature and composition throughout the processing sequence.
3Productivity
If deionized water is heated for post-electrofill processing, then processing speed is improved, but energy consumption increases
Solution Approach 1:
The patent applies continuity of useful action by implementing a recirculation system that continuously circulates heated deionized water through the post-electrofill processing equipment. This continuous circulation maintains optimal processing temperatures without requiring constant reheating, thereby improving processing speed while minimizing energy consumption. The system invests energy once to heat the water and then recirculates it, avoiding repeated heating cycles.
Solution Approach 2:
The patent utilizes preliminary action by pre-heating the deionized water before it enters the post-electrofill processing equipment. Instead of heating water during each processing step, the system pre-heats the water in advance and maintains it at the required temperature through recirculation. This preliminary heating action reduces the total energy required during actual processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly reduces processing time and solvent usage, enhancing throughput and reducing costs by ensuring faster and more efficient wafer rinsing and drying with improved adhesion of subsequent layers, while minimizing defects and waste.
Implementation Method 1
a degassing station configured to remove dissolved gas from the deionized water flow
Implementation Method 2
a heating station configured to heat the deionized water flow
Data Source
AI summary
An apparatus for conditioning deionized water and delivering it to a semiconductor wafer in a post electrofill module includes a degassing station configured to remove dissolved gas from the deionized water flow, a heating station configured to heat the deionized water flow, and a nozzle configured to deliver the deionized water flow to the wafer. The heating and degassing are performed before the delivery of the deionized water flow to the wafer. In some implementations the degassing station includes a contact degasser or an inert gas bubbler, and the heating station is configured to heating the deionized water flow to a temperature of between about 35-40° C. In some embodiments the deionized water flow is passed through the degassing station before being passed through the heating station.