Delamination Apparatus for OLED Thermal Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The delamination process in thermal imaging methods for organic light emitting diode (OLED) displays often results in defects due to the complexity of separating the donor film from the acceptor substrate, which affects the precision and quality of the organic layer patterning.
Innovation Solution
A delamination apparatus and inline thermal imaging system are developed, comprising a stage, first and second roll units, a gripper, and a peeling tip with an inhaling member, which allows for controlled delamination of the donor film from the acceptor substrate, minimizing defects by using a combination of rolls and a cutter to separate and remove the film while preventing air and particle penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional delamination process is used to separate the donor film from the acceptor substrate, then the organic layer can be transferred, but defects are generated due to the complexity of the separation process
Solution Approach 1:
The patent introduces a release film as an intermediary layer between the donor film and the acceptor substrate. This release film facilitates controlled delamination by providing a temporary bonding interface that can be selectively removed. The release film includes a first release layer and a second release layer that work together to enable precise separation of the donor film from the acceptor substrate while maintaining organic layer integrity, thereby resolving the contradiction between transfer reliability and patterning precision.
Solution Approach 2:
The delamination process is segmented into multiple controlled stages: initial bonding of donor film to acceptor substrate through the release film, laser-induced selective removal of the organic layer from the donor film, and controlled separation of the donor film from the acceptor substrate. This segmentation allows each step to be optimized independently, improving both the reliability of the delamination process and the precision of the organic layer patterning.
2Reliability
If additional films are used in the thermal imaging system, then the delamination process can be controlled, but manufacturing time and costs increase
Solution Approach 1:
The patent merges the release film structure with the donor film assembly in an integrated manner. The first release layer is positioned at the donor film side while the second release layer contacts the acceptor substrate, creating a unified delamination system that controls the separation process without requiring multiple independent components. This merging reduces the number of separate films and processing steps needed, thereby improving manufacturing efficiency while maintaining delamination control.
Solution Approach 2:
The release film structure is designed to enable self-controlled delamination through the laser-induced thermal imaging process. The organic layer acts as the delamination agent itself, as its selective removal automatically initiates and drives the separation process between the donor film and acceptor substrate. This self-service mechanism eliminates the need for additional external delamination tools or complex multi-film systems, improving productivity while maintaining process control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively minimizes defects during the delamination process, ensuring high precision and quality of the organic layer patterning, reducing manufacturing time and costs by performing lamination, imaging, and delamination in an inline manner without the need for additional films.
Implementation Method 1
a transport apparatus, which may be adjacent to the delamination apparatus and may include a laser unit for radiating laser to the donor film corresponding to the substrate area of the stage
Implementation Method 2
a peeling tip with an inhaling member, which allows for controlled delamination of the donor film from the acceptor substrate
Data Source
AI summary
A delamination apparatus includes a stage, a first roll unit, a gripper, and a second roll unit. The stage includes a peripheral area and a substrate area. An edge of a donor film is attached at the peripheral area. An acceptor substrate, laminated at on the donor film, is disposed at the substrate area. The first roll unit is disposed on the donor film, moves in a lengthwise direction of the acceptor substrate. The gripper is disposed on the donor film, and is configured to separate the edge of the donor film from the stage so as to cause the donor film to contact the first roll unit. The second roll unit is disposed on the stage, contacts the donor film which contacts the first roll unit, and delaminates the donor film from the acceptor substrate by moving in the lengthwise direction with the first roll unit.