Delamination-Resistant Semiconductor Device With Spacer
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Solution Overview
Problem
Wafer-level delamination during the manufacturing of image sensors for cameras and consumer electronics often results in inoperable sensors, due to issues with layer separation and moisture penetration, leading to malfunctions such as short-circuits and light scattering.
Innovation Solution
A delamination-resistant semiconductor device is designed with a conductive stack, a semiconductor layer, and a dam structure that includes a protective layer and apertures, where the dam functions as a spacer to prevent moisture penetration, and a method involving the deposition of layers to span apertures and recesses, ensuring structural integrity and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer-level manufacturing process is used for image sensors, then manufacturing efficiency and productivity are improved, but delamination occurs during manufacturing leading to inoperable sensors
Solution Approach 1:
The patent divides the continuous wafer structure into discrete sensor units by introducing trenches that physically separate adjacent image sensors. This segmentation prevents delamination from propagating across the entire wafer, allowing wafer-level manufacturing to continue while improving individual sensor reliability.
Solution Approach 2:
The patent applies a protective coating to the wafer surface before completing the manufacturing process. This preliminary protective action prevents moisture penetration and delamination during subsequent manufacturing steps, ensuring sensor functionality is maintained throughout the manufacturing sequence.
2Device complexity
If multiple layers are stacked in wafer-level manufacturing, then device integration is improved, but layer separation and moisture penetration cause delamination
Solution Approach 1:
The patent introduces a protective coating as an intermediary layer between the stacked sensor layers and the external environment. This coating acts as a barrier that prevents moisture from penetrating between layers, thereby maintaining structural integrity while preserving the benefits of multi-layer integration.
Solution Approach 2:
By introducing trenches that segment the wafer into discrete sensor regions, the patent prevents delamination from affecting the entire stacked structure. This segmentation maintains the integrity of each layered unit while allowing high device integration within each segmented region.
3Ease of manufacture
If continuous wafer structure is maintained, then manufacturing simplicity is improved, but moisture penetration causes short-circuits and light scattering
Solution Approach 1:
The protective coating serves as an intermediary barrier that blocks moisture from reaching the sensitive internal structures of the image sensors. This allows the continuous wafer structure to be maintained for manufacturing simplicity while the coating prevents harmful moisture penetration that would cause short-circuits and light scattering.
Solution Approach 2:
The protective coating is applied in advance during the manufacturing process, creating a preliminary barrier against moisture before the sensors are fully assembled and packaged. This preliminary protective action maintains manufacturing simplicity while preventing harmful effects throughout the product lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents delamination and moisture-related malfunctions, enhancing the reliability and longevity of image sensors by maintaining structural integrity and preventing electrical shorts and light scattering issues.
Implementation Method 1
a conductive layer, a semiconductor layer, and a spacer. The conductive layer has a first side opposite a second side. The semiconductor layer is on the first side and defines an aperture therethrough spanned by the conductive layer
Implementation Method 2
The spacer is on the second side and has a top surface, proximate the conductive layer, that defines a blind hole spanned by the conductive layer
Data Source
AI summary
A delamination-resistant semiconductor device includes a conductive layer, a semiconductor layer, and a spacer. The conductive layer has a first side opposite a second side. The semiconductor layer is on the first side and defines an aperture therethrough spanned by the conductive layer. The spacer is on the second side and has a top surface, proximate the conductive layer, that defines a blind hole spanned by the conductive layer. A method for preventing delamination of a multilayer structure, includes a step of disposing a first layer on a substrate such that the first layer spans an aperture of the substrate. The method also includes a step of disposing a second layer on the first layer. The second layer has a blind hole adjacent to the first layer such that the first layer spans the blind hole.