Delamination System for Semiconductor Substrates
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Solution Overview
Problem
The existing delamination processes for semiconductor substrates do not consider efficiency, leading to inefficiencies in the delamination of large-diameter and thin-thickness semiconductor substrates during manufacturing, which can result in warping or cracking during transfer or grinding operations.
Innovation Solution
A delamination system is introduced that includes a first processing block for the laminated substrate and a second processing block for the support substrate, utilizing a dicing frame and tape for holding, edge cut, delamination, and cleaning processes, with specific devices for transferring and processing the substrates to enhance throughput and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional delamination process is used for large-diameter, thin-thickness semiconductor substrates, then the substrate can be delaminated from the support substrate, but the substrate may experience warping or cracking during transfer or grinding operations due to lack of reinforcement
Solution Approach 1:
The patent applies preliminary action by bonding the support substrate to the semiconductor substrate before the grinding process. This reinforcement is performed in advance to prevent warping or cracking during subsequent transfer or grinding operations, rather than addressing these issues after they occur.
2Productivity
If the support substrate is delaminated after bonding, then the semiconductor substrate can be processed, but the existing delamination process does not consider efficiency, leading to reduced throughput
Solution Approach 1:
The patent applies segmentation by dividing the delamination process into distinct stages: (1) delaminating the support substrate from the semiconductor substrate while it remains bonded to the first substrate, and (2) subsequently delaminating the semiconductor substrate from the first substrate. This segmented approach enables parallel processing and improves overall throughput compared to sequential delamination.
Solution Approach 2:
The patent maintains continuity of useful action by keeping the semiconductor substrate bonded to the first substrate during the support substrate delamination process. This allows the delamination operation to proceed without interrupting the substrate's support structure, thereby reducing idle time and improving efficiency.
3Reliability
If the semiconductor substrate is reinforced by bonding a support substrate, then warping and cracking are prevented during transfer and grinding, but additional delamination steps are required after processing
Solution Approach 1:
The patent segments the reinforcement structure into multiple layers: the semiconductor substrate bonded to the first substrate, with the support substrate bonded to the semiconductor substrate. This layered structure allows the support substrate to be delaminated first, followed by controlled delamination of the semiconductor substrate from the first substrate, enabling parallel processing operations.
Solution Approach 2:
The patent applies preliminary action by pre-bonding the semiconductor substrate to the first substrate before the support substrate delamination process. This preliminary reinforcement ensures substrate stability during subsequent operations while enabling efficient parallel processing through the segmented delamination approach.
Data Source
AI summary
A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.