Dendritic Layer Heat Transfer Element for Semiconductor Cooling
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Solution Overview
Problem
The increased power density in semiconductor device packages leads to heat dissipation challenges, as existing heat transfer elements struggle to efficiently manage heat dissipation while minimizing size and maintaining high integration density.
Innovation Solution
A heat transfer element featuring a housing with a dendritic layer on its inner surface and a working fluid within a chamber, where the dendritic layer enhances capillary force and fluid flow, allowing efficient heat transfer and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the integration density of electronic components is increased, then the power density increases, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent employs a dendritic layer with porous structure as the heat transfer element. The porous structure provides high surface area to volume ratio, enhancing capillary action and working fluid circulation. This resolves the contradiction by enabling efficient heat dissipation through the porous dendritic network even at high integration densities where space is constrained.
Solution Approach 2:
The heat transfer element utilizes phase change of the working fluid (evaporation and condensation) within the dendritic structure to transfer heat. The phase transition process absorbs and releases latent heat, providing superior heat dissipation efficiency that can handle the increased power density from higher integration without requiring larger heat sink sizes.
2Volume of moving object
If the size of heat transfer element is reduced, then integration density improves, but heat transfer efficiency deteriorates
Solution Approach 1:
The dendritic layer exhibits local quality variations with different pore sizes and dendrite arm thicknesses optimized for specific functions. The primary dendrite arms provide structural support while secondary and tertiary arms create capillary channels. This localized optimization enables efficient heat transfer in a compact volume, resolving the size-efficiency contradiction.
Solution Approach 2:
The dendritic structure utilizes three-dimensional spatial arrangement with hierarchical branching patterns. This 3D configuration maximizes the heat transfer surface area within a minimal volume, allowing the heat transfer element to maintain high efficiency while being miniaturized for high integration density applications.
3Temperature
If a dendritic layer is added to enhance capillary ability, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The dendritic layer is formed through electroplating processes where the structure self-organizes into hierarchical dendritic patterns driven by current density distribution. This self-organizing mechanism reduces manufacturing complexity compared to top-down fabrication, as the complex dendritic structure emerges automatically from the plating process parameters rather than requiring precise control of each feature.
Solution Approach 2:
The dendritic structure can be controlled by adjusting electroplating parameters such as current density, plating time, and electrolyte composition. By changing these process parameters, the dendrite arm thickness, pore size, and overall structure can be optimized for different heat transfer requirements without fundamentally changing the manufacturing method, thus managing complexity while achieving high efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dendritic layer provides superior capillary ability and permeability, facilitating effective heat transfer and dissipation, with a manufacturing process that is cost-effective and easily integratable into semiconductor structures, enabling miniaturization while maintaining or exceeding existing heat transfer efficiencies.
Implementation Method 1
The dendritic layer provides superior capillary ability and permeability, facilitating effective heat transfer and dissipation
Implementation Method 2
The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber
Implementation Method 3
heat dissipation becomes an issue. Thus, it is desirable to have a heat transfer element having good heat dissipation efficiency
Data Source
AI summary
A heat transfer element, a method for manufacturing the same and a semiconductor structure including the same are provided. The heat transfer element includes a housing, a chamber, a dendritic layer and a working fluid. The chamber is defined by the housing. The dendritic layer is disposed on an inner surface of the housing. The working fluid is located within the chamber.