Coated Substrate With Dense Metal-Oxide Film for Complex Shapes
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Solution Overview
Problem
Conventional coated substrates are not suitable for various applications and mass production, particularly in complex shapes, as they lack effective thickness control and uniform film distribution.
Innovation Solution
A coated substrate with a film thickness of 1 nm to 800 nm, having a total metal and oxygen composition of 70 atm% or greater, a relative density of 90% or greater, and specific thickness variations on edge and convex regions, formed using a dry film-formation method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wet film-formation method is employed, then film formation is simple, but thickness control on complex substrate shapes is poor
Solution Approach 1:
The patent replaces the wet chemical deposition method with a physical vapor deposition method (sputtering). This substitution allows for precise thickness control through process parameters (power, time, gas flow) while maintaining ease of manufacture through automated deposition processes. The sputtering method enables uniform film formation on complex substrate shapes by controlling the deposition environment and parameters.
Solution Approach 2:
The patent utilizes parameter changes in the sputtering process (radio frequency power, deposition time, oxygen flow rate, argon flow rate) to achieve precise control over film thickness and composition. By adjusting these parameters, the method achieves both uniform thickness on complex geometries and controlled metal oxide composition, resolving the contradiction between manufacturing simplicity and thickness precision.
2Adaptability or versatility
If conventional coating methods are used, then mass production is difficult, but novel applications are limited
Solution Approach 1:
The sputtering-based coating method provides universal applicability across different substrate types (electrodes, catalyst supports, sensors) and shapes (planar, three-dimensional, complex geometries). The process can be scaled from single-substrate to multi-substrate batch processing, enabling both novel applications in various fields and mass production capability through standardized deposition procedures.
3Reliability
If film thickness is increased to improve coverage, then edge regions are better covered, but overall film uniformity decreases
Solution Approach 1:
The patent achieves local quality optimization by controlling the sputtering deposition geometry and parameters. The method naturally produces thicker films on edge regions through controlled deposition angles and extended deposition time, while maintaining uniform composition throughout. This local thickness variation is intentionally designed to ensure complete edge coverage while preserving overall film uniformity through consistent material deposition rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coated substrate provides enhanced functionality and durability, allowing mass production and application in various fields without requiring expensive materials or additional treatments, while maintaining adhesion and stress mitigation.
Implementation Method 1
a dry film-formation method (dry process) has been employed
Data Source
AI summary
A novel coated substrate which can be applied to various fields and can be mass-produced is provided. A coated substrate has a substrate coated with a film. The thickness of the film is 1 nm or greater and less than 800 nm. X-ray photoelectron spectroscopic measurement of the film shows that the total percent element composition of a metal element and O (oxygen) is 70 atm % or greater. The relative density of the film is 90% or greater. The coated substrate satisfies at least one of the following conditions (1) and (2).Condition (1): the maximum thickness of the film formed on an edge region of a surface of the substrate is greater than the thickness of the film formed on an inner region of the surface located inward of the edge region.Condition (2): the maximum thickness of the film formed on a convex portion present region of the surface of the substrate is greater than the thickness of the film formed on a convex portion absent region of the surface.