Density-Conversion Connector for High-Density Via Interconnects
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Solution Overview
Problem
Existing semiconductor device assemblies face challenges in connecting devices with different connector densities, particularly when high-density exposed via pillars need to be connected to those with lower-density connection arrays, and there is a need to test these assemblies while connected to an external device.
Innovation Solution
The implementation of density-conversion connectors, which include a substrate with two arrays of contacts, one with a higher density matching the high-density pillars and another with a lower density matching standard layouts, allowing for electrical coupling of exposed via portions into solder balls on one side and connecting to an array of electrical contacts on the other side, enabling the connection of semiconductor devices with varying densities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If high-density exposed via pillars are connected directly to lower-density connection arrays, then manufacturing complexity increases and damage risk increases, but connection functionality is achieved
Solution Approach 1:
A substrate is introduced as an intermediary component between the high-density pillar array and the lower-density connection array. The substrate provides a transition interface with two different connection arrays: a first array matching the high-density pillars and a second array matching the lower-density target. This mediator enables density conversion while protecting the conductive layers and simplifying the manufacturing process.
Solution Approach 2:
The connection system is segmented into three distinct parts: the high-density pillar array, the substrate with dual arrays, and the lower-density connection array. This segmentation allows each component to be optimized independently for its specific function, with the substrate serving as a transition element that bridges the density mismatch between pillars and connection arrays.
2Adaptability or versatility
If density conversion is implemented using traditional methods, then connection between different densities is achieved, but the conductive layers are at risk of damage
Solution Approach 1:
The substrate is designed with appropriate mechanical properties and thickness to cushion and distribute mechanical stresses during the connection process. This prior cushioning protects the fragile conductive layers from damage that would occur during direct connection attempts, while still enabling the density conversion functionality.
3Productivity
If direct connection is made between high-density pillars and lower-density arrays, then assembly can proceed, but testing capability is limited
Solution Approach 1:
The substrate serves multiple functions: it acts as a mechanical support, provides density conversion, enables testing capabilities through its dual arrays, and protects conductive layers. This multi-functionality allows the assembly to maintain high productivity while simultaneously enabling comprehensive testing and measurement capabilities that would be difficult to achieve with direct connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient electrical connection of semiconductor devices with different connector densities, facilitating testing and assembly while reducing the risk of damage to the conductive layers, and enabling the use of standard connection configurations.
Implementation Method 1
The solder balls can be reflowed, for example, by heating
Data Source
AI summary
A semiconductor device assembly can include a semiconductor device having a substrate and vias electrically connected to circuitry of the semiconductor device. Individual vias can have an embedded portion extending from the first side to the second side of the substrate and an exposed portion projecting from the second side of the substrate. The assembly can include a density-conversion connector comprising a connector substrate and a first array of contacts formed at the first side thereof, the first array of contacts occupying a first footprint area on the first side thereof, and wherein individual contacts of the first array are electrically connected to the exposed portion of a corresponding via of the semiconductor device. The assembly can include a second array of contacts electrically connected to the first array, formed at the second side of the connector substrate, and occupying a second footprint area larger than the first footprint area.