Deployable Structures With Oscillating Heat Pipes for Compact Cooling
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Solution Overview
Problem
Conventional thermal management systems for flight vehicles, such as satellites, occupy significant space due to passive and actively-facilitated heat transport mechanisms, reducing payload capacity and functionality.
Innovation Solution
Integration of shape-memory alloys with oscillating heat pipes in deployable structures to passively or actively transfer thermal energy, allowing for space-efficient heat dissipation without external power or electronics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional passive thermal management systems are used, then heat dissipation is achieved, but significant space is occupied reducing payload capacity
Solution Approach 1:
The patent combines the thermal management function with the structural support function by integrating oscillating heat pipes directly into the load-bearing structure. The heat pipes are embedded within structural members, allowing the same component to provide both mechanical support and thermal conduction, thereby eliminating the need for separate thermal management hardware and reducing overall system volume.
Solution Approach 2:
The structural members are designed to serve multiple functions simultaneously: they provide mechanical support for the flight vehicle while also acting as thermal conduction pathways through integrated oscillating heat pipes. This multi-functionality reduces the total component count and space requirements compared to conventional systems where thermal management is a separate subsystem.
2Temperature
If actively-deployed thermal management systems are used, then surface area is increased for heat rejection, but space and power requirements increase
Solution Approach 1:
The oscillating heat pipes are designed to operate passively without external power sources. They utilize the natural oscillation of working fluid phases (liquid-vapor transitions) driven by temperature gradients alone to achieve thermal conduction. This self-service mechanism eliminates the need for external actuators, motors, or control systems that would consume power and occupy space.
Solution Approach 2:
The patent replaces active mechanical deployment systems (motors, actuators, control electronics) with a passive thermomechanical system. The oscillating heat pipes use inherent thermodynamic principles to achieve thermal management functions without requiring external mechanical actuation or electrical power, thereby reducing both power consumption and system complexity.
3Temperature
If shape-memory materials are integrated with heat pipes, then thermal conductivity is enhanced, but device complexity increases
Solution Approach 1:
The patent merges the shape-memory material functionality with the heat pipe structure by embedding the oscillating heat pipes within the shape-memory structural members. This integration allows the shape-memory materials to provide structural support and controlled deployment while the heat pipes provide thermal conduction, achieving enhanced thermal management without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity and reduces space, weight, and power requirements by integrating actuators directly in the heat transfer path, enabling passive deployment of radiators and panels.
Implementation Method 1
At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change
Implementation Method 2
The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions
Implementation Method 3
one or more oscillating heat pipes embedded in at least some of the thermomechanical regions
Implementation Method 4
structure configured to receive thermal energy and to reject the thermal energy into an external environment
Data Source
AI summary
An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.