Deposition Device Angle Limitation Plates Emissive Display Uniformity
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Solution Overview
Problem
Existing deposition methods for emissive display devices suffer from non-uniform doping in the film thickness direction of the emission layer, leading to thermal degradation and reduced lifetime of the light-emitting elements.
Innovation Solution
A deposition device with multiple deposition sources and angle limitation plates is used to control the incident angles of deposition materials, ensuring uniform doping by partially overlapping regions of dopant and host materials on the substrate, reducing thermal degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single deposition source is used to deposit emission layer materials, then the deposition process is simple, but the doping uniformity in the film thickness direction deteriorates
Solution Approach 1:
The single deposition source is divided into multiple deposition sources (first, second, third deposition sources) that sequentially deposit different materials (dopant, host, dopant). This segmentation allows each source to deposit a specific layer with controlled thickness and composition, achieving uniform doping throughout the emission layer while maintaining process simplicity through sequential operation.
2Manufacturing precision
If multiple deposition sources are used to improve doping uniformity, then the doping uniformity improves, but the device complexity increases
Solution Approach 1:
Multiple deposition sources are merged into a single chamber and operated sequentially to deposit different materials. The first, second, and third deposition sources work in sequence to deposit dopant, host, and dopant materials respectively, achieving uniform doping without requiring separate processing steps or complex multi-chamber systems.
Solution Approach 2:
The deposition process uses periodic action by sequentially activating different deposition sources at different time periods. The first deposition source operates first to deposit dopant material, then the second source deposits host material, followed by the third source depositing dopant material again. This periodic operation ensures uniform doping distribution while maintaining a relatively simple device structure.
3Area of stationary object
If deposition sources are arranged close together, then the device size is reduced, but the incident angle control precision deteriorates
Solution Approach 1:
Each deposition source is equipped with specific angle limitation plates that create different incident angle ranges for deposited materials. The first deposition source has angle limitation plates creating a first incident angle range, the second source has plates creating a second incident angle range, and the third source has plates creating a third incident angle range. This local differentiation of incident angles ensures precise control despite the compact arrangement of sources.
4Ease of manufacture
If non-uniform doping is present in the emission layer, then the manufacturing process is simpler, but the lifetime of light-emitting elements deteriorates due to thermal degradation
Solution Approach 1:
The emission layer is segmented into multiple sub-layers with different compositions deposited by different sources. The first deposition source deposits dopant material, the second source deposits host material, and the third source deposits dopant material again. This segmentation creates a uniformly doped emission layer that prevents thermal degradation and extends device lifetime while maintaining manufacturing simplicity through sequential deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves doping uniformity in the emission layer, enhancing the lifetime of the light-emitting elements and reducing thermal degradation of the deposition materials.
Implementation Method 1
When the deposition source is heated, the deposition material in the deposition source is vaporized, and the vaporized deposition material is sprayed through a nozzle
Implementation Method 2
the vaporized deposition material is sprayed through a nozzle. The sprayed deposition material is deposited on a substrate to form a thin film
Data Source
AI summary
A deposition device according to an embodiment includes a first deposition source, a second deposition source, and a third deposition source arranged sequentially in a first direction, a first angle limitation plate disposed outside of the first deposition source, a second angle limitation plate disposed between the first deposition source and the second deposition source, a third angle limitation plate disposed between the second deposition source and the third deposition source, and a fourth angle limitation plate disposed outside the third deposition source. A deposition material of the first deposition source and a deposition material of the third deposition source include a same dopant material. A deposition material of the second deposition source includes a host material.