Thin Film Deposition Blade Prevents Nozzle Material Accumulation
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Solution Overview
Problem
The existing deposition methods for organic light-emitting display devices, particularly those using fine metal masks, face challenges in scalability, alignment accuracy, and low deposition efficiency, with a significant portion of deposition material adhering to the deposition apparatus rather than the substrate.
Innovation Solution
A thin film deposition apparatus featuring a deposition blade that separates the deposition material from the nozzle unit during the stand-by mode, preventing material deposition on undesirable regions and enhancing efficiency by directing the material onto the substrate, while the apparatus includes a deposition source, nozzle units, and barrier walls to manage the deposition process effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine metal mask (FMM) is used for deposition, then the deposition pattern precision is improved, but the deposition efficiency deteriorates with only about 32% of material reaching the substrate
Solution Approach 1:
The patent removes the fine metal mask (FMM) from the deposition system entirely. Instead of using a mask to define patterns, the invention uses direct geometric control through the nozzle unit structure and barrier walls to guide deposition material only to desired areas, eliminating the mask and its associated efficiency losses.
Solution Approach 2:
The patent introduces barrier walls as intermediary structures between the deposition source and substrate. These walls act as mediators that redirect deposition material flow, ensuring material reaches only the intended deposition areas without requiring a mask, thereby improving both precision and efficiency.
2Area of stationary object
If the fine metal mask size is increased to match larger substrates, then the coverage area is improved, but the manufacturing complexity and alignment accuracy deteriorate
Solution Approach 1:
The patent segments the deposition system into multiple independent nozzle units, each capable of depositing material in specific regions. This allows the system to cover large substrate areas without requiring a single large mask, instead using multiple smaller, independently controllable nozzles that can be positioned and operated separately.
Solution Approach 2:
The patent transitions from a two-dimensional mask plane to a three-dimensional spatial control system using barrier walls and movable nozzle units. This dimensional change allows coverage of large substrate areas through vertical and lateral positioning rather than requiring a proportionally large mask.
3Productivity
If the deposition source operates continuously, then the deposition rate is improved, but the material loss on the nozzle unit increases during stand-by mode
Solution Approach 1:
The patent makes the nozzle unit movable rather than fixed, allowing it to be dynamically repositioned between deposition positions and stand-by positions. During stand-by mode, the nozzle can be moved away from areas where material would otherwise accumulate, enabling continuous operation without proportional material waste.
Solution Approach 2:
The patent extracts the nozzle unit from the fixed deposition path during stand-by operations. By removing or repositioning the nozzle away from the deposition area when not actively depositing, the system prevents material from accumulating on the nozzle itself while maintaining continuous material flow from the source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves deposition efficiency by preventing material loss on the nozzle unit and ensuring continuous deposition on the substrate, even during stand-by modes, thereby reducing material waste and facilitating the reuse of deposition material.
Implementation Method 1
a deposition source that is disposed opposite to a substrate and includes a deposition material that is vaporized
Implementation Method 2
a thin film deposition apparatus for depositing a deposition material on a substrate
Data Source
AI summary
A thin film deposition apparatus includes a deposition source that is disposed opposite to a substrate and holds a deposition material that is vaporized; a first nozzle unit disposed between the substrate and the deposition source and having first slit units arranged in a first direction of the substrate; a second nozzle unit disposed between the first nozzle unit and the substrate and having second slit units arranged in the first direction of the substrate; and at least one barrier member assembly disposed between the first nozzle unit and the second nozzle unit and partitioning the space between the first nozzle unit and the second nozzle unit. A deposition blade is optionally disposed in any space formed between the first nozzle unit and the second nozzle unit during a stand-by mode to prevent the deposition of the deposition material from being deposited onto undesirable regions of the chamber.