Thin Film Deposition System With Byproduct Sensor Feedback

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Solution Overview

Problem

Thin film deposition techniques face challenges in ensuring proper formation of thin films due to sensitivity to fluid flow rates and concentrations, leading to potential improper film composition and thickness, which can result in scrapped semiconductor wafers and resource wastage.

Innovation Solution

A thin film deposition system that monitors fluid flow by detecting byproducts in exhaust fluids and adjusts flow rates in real time, detects low fluid levels, and refills or replaces sources to maintain optimal fluid supply, ensuring accurate and reliable thin film formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If thin film deposition techniques are used to form very thin films, then film thickness is reduced, but manufacturing precision deteriorates due to sensitivity to fluid flow rates and concentrations

Engineering Contradiction:
Improvefilm thicknessVSAvoidfilm composition and thickness control
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The system employs sensors to monitor fluid flow rates and concentrations in real-time during deposition, feeding this information back to controllers that automatically adjust flow parameters. This closed-loop feedback mechanism maintains manufacturing precision even when forming extremely thin films by compensating for variations in fluid delivery.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent replaces manual mechanical control of fluid delivery with automated electronic control systems. Controllers electronically regulate flow rates and concentrations, substituting mechanical adjustment mechanisms with precision electronic control that eliminates human error and improves repeatability in thin film formation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Device complexity

If manual monitoring of fluid flow is performed, then device complexity is reduced, but reliability deteriorates due to inability to detect and correct fluid flow variations

Engineering Contradiction:
Improvemonitoring system complexityVSAvoidfilm formation reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The system performs self-monitoring and self-correction of fluid flow parameters. Sensors automatically detect variations in flow rates and concentrations, and the control system autonomously adjusts parameters to maintain optimal deposition conditions, eliminating the need for manual intervention while ensuring reliable film formation.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent introduces intermediary sensors and control systems between the fluid delivery mechanism and the deposition process. These intermediaries continuously monitor fluid properties and mediate adjustments to maintain reliable deposition, acting as a buffer that ensures consistent film formation without requiring complex direct control.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If real-time fluid flow monitoring and adjustment is implemented, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvefilm thickness and composition controlVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The control system is designed to perform multiple functions: monitoring fluid flow rates, analyzing sensor data, adjusting flow parameters, and recording process information. By consolidating these functions into a single integrated control platform, the system achieves high manufacturing precision without proportionally increasing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines sensing, control, and adjustment functions into an integrated system. Sensors, controllers, and flow adjustment mechanisms are merged into a coordinated unit that operates as a cohesive whole, reducing the complexity that would arise from separate independent systems while maintaining precise film formation control.

Inventive Principle:
Principle #5Merging (Combining)

4Productivity

If automated fluid level detection and refill is implemented, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improvedeposition process efficiencyVSAvoidfluid management system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system performs preliminary detection of fluid levels and proactively refills or replaces fluid sources before depletion occurs. By anticipating and preventing fluid exhaustion, the system maintains continuous deposition operations, improving productivity without requiring complex emergency response mechanisms.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures the formation of thin films with consistent thickness and composition, reducing waste and resource expenditure by maintaining optimal fluid flow and supply during the deposition process.

Implementation Method 1

a byproduct sensor configured to sense byproducts in the exhaust fluid and to generate sensor signals indicative of the byproducts

Methodology Applied
Scientific EffectByproduct detection: Absorption Spectroscopy

Implementation Method 2

forming a thin film on a substrate within a thin film deposition chamber by flowing a first fluid into the thin film deposition chamber

Methodology Applied
Scientific EffectChemical Vapor Deposition: Chemical Vapour Deposition

Data Source

PatentUS20220356578A1System and method for monitoring and performing thin film deposition
Publication Date: 2022.11.10 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20220356578A1 patent drawing
  • US20220356578A1 patent drawing
  • US20220356578A1 patent drawing

AI summary

A thin film deposition system deposits a thin film on a substrate in a thin film deposition chamber. The thin film deposition system deposits the thin film by flowing a fluid into the thin film deposition chamber. The thin film deposition system includes a byproducts sensor that senses byproducts of the fluid in an exhaust fluid. The thin film deposition system adjusts the flow rate of the fluid based on the byproducts.