Deposition Apparatus Chuck with Segmented Voltage for Substrate Sagging

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Solution Overview

Problem

Existing deposition processes face challenges in preventing substrate sagging, particularly for large-sized substrates, which can lead to defects such as shadows, reducing process reliability and increasing costs and time.

Innovation Solution

A deposition apparatus is designed with a chuck and support unit that includes a first and second pattern portion with different voltages, and a support unit with first and second support units to stabilize the substrate, effectively preventing sagging by varying the attractive force across different substrate regions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single uniform voltage is applied to the chuck, then the structure is simple, but substrate sagging occurs leading to deposition defects

Engineering Contradiction:
Improveprocess reliabilityVSAvoidchuck structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The chuck is divided into multiple pattern portions (first pattern portion and second pattern portion) with different voltage applications. This segmentation allows different regions of the substrate to receive customized electrostatic forces, preventing sagging while maintaining manageable structural complexity through modular design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different voltages are applied to different pattern portions of the chuck based on the specific sagging characteristics of substrate regions. This local quality approach ensures that each area receives the appropriate electrostatic force to maintain flatness, improving process reliability without requiring complete redesign of the entire chuck system.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If support units are added to prevent substrate sagging, then substrate flatness is improved, but the apparatus complexity increases

Engineering Contradiction:
Improvesubstrate flatnessVSAvoidapparatus structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The support units are integrated with the existing chuck structure, combining the electrostatic chucking function with mechanical support functionality. This merging approach provides substrate flatness control through support units while avoiding the complexity of completely separate support systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support units act as intermediaries between the substrate and the deposition chamber structure, providing necessary mechanical support to prevent sagging. These support units are positioned to minimize interference with the deposition process while effectively controlling substrate flatness.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If different voltages are applied to different pattern portions, then substrate sagging is prevented, but energy consumption increases

Engineering Contradiction:
Improvedeposition process reliabilityVSAvoidchuck energy consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

Instead of applying high voltage uniformly across the entire chuck, different voltages are applied only to specific pattern portions where needed. This partial action approach prevents substrate sagging in critical areas while minimizing overall energy consumption by avoiding unnecessary high voltage application in regions where sagging is not an issue.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances process reliability by minimizing substrate sagging, ensuring accurate alignment and reducing defects, thereby lowering costs and time required for the deposition process, even for large-sized substrates.

Implementation Method 1

a chuck facing the first surface of the substrate, and having a first pattern portion and a second pattern portion that are adjacent to each other, and receive different voltages, respectively

Methodology Applied
Scientific EffectElectrostatic force: Electrostatics

Data Source

PatentUS20240141496A1Deposition apparatus
Publication Date: 2024.05.02 SAMSUNG DISPLAY CO LTD
  • US20240141496A1 patent drawing
  • US20240141496A1 patent drawing
  • US20240141496A1 patent drawing

AI summary

A deposition apparatus including a support unit that supports a second surface of a substrate having a first surface and the second surface opposed to the first surface, and a chuck having a first pattern portion and a second pattern portion that are adjacent to each other, and receive different voltages, respectively. The substrate has a first part overlapping the first pattern portion of the chuck and a second part overlapping the second pattern portion of the chuck, and the support unit has a first support unit and a second support unit that support different portions of the second part.