Deposition Chuck and Susceptor Cooling for Thin-Film Temperature Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing deposition apparatuses experience temperature unevenness on the substrate surface during the deposition process, leading to defects such as stains in the thin film, which affects the reliability of display panels.
Innovation Solution
The deposition apparatus incorporates a susceptor and electrostatic chuck design with protruding pins that include independent coolers at both the susceptor and electrostatic chuck levels, along with a plate cooler, to maintain uniform temperature and prevent stains by controlling temperature differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional deposition apparatus is used, then the deposition process can be performed, but temperature unevenness occurs on the substrate surface leading to stains in the thin film
Solution Approach 1:
The cooling system is segmented into multiple independent coolers: a first cooler in the electrostatic chuck, a second cooler in the susceptor, and a third cooler in the plate. Each cooler can be independently controlled to address temperature unevenness at different locations, preventing stains in the thin film while maintaining deposition capability
Solution Approach 2:
Different regions of the deposition apparatus are equipped with different cooling capabilities. The electrostatic chuck, susceptor, and plate each have dedicated coolers that can be independently adjusted, allowing local temperature control to prevent stains while maintaining overall deposition process functionality
2Temperature
If multiple coolers are added to the deposition apparatus, then temperature unevenness is reduced, but device complexity increases
Solution Approach 1:
Multiple coolers (first cooler in electrostatic chuck, second cooler in susceptor, third cooler in plate) are integrated into a unified cooling system that shares common refrigerant circulation pathways and control mechanisms. This merging approach enables temperature uniformity across different components while avoiding the complexity of completely independent cooling systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature unevenness, preventing stains and enhancing the reliability of the thin film formation process, thereby improving the overall quality of display panels.
Implementation Method 1
a cooler provided with a cooling line, and a refrigerant which circulates through the cooling line
Implementation Method 2
an electrostatic chuck disposed on the susceptor and provided with a plurality of electrostatic chuck holes defined therein
Data Source
AI summary
A deposition apparatus includes: a susceptor provided with a plurality of susceptor holes defined therein; an electrostatic chuck disposed on the susceptor and provided with a plurality of electrostatic chuck holes defined therein; and a plurality of pins penetrating through the susceptor and the electrostatic chuck to connect the susceptor and the electrostatic chuck. Each of the pins includes a first portion disposed in a corresponding electrostatic chuck hole of the plurality of electrostatic chuck holes and a second portion disposed in a corresponding susceptor hole of the plurality of susceptor holes. The first portion includes a first base portion and a first cooler disposed in the first base portion.