Deposition Apparatus Cooling Plate for OLED Encapsulation
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Solution Overview
Problem
The challenge lies in effectively forming and improving the characteristics of encapsulation layers in organic light emitting display apparatuses through deposition processes, as existing methods struggle to control deposition processes and achieve desired film characteristics.
Innovation Solution
A deposition apparatus is designed with a chamber, a deposition source, cooling plates, refrigerators, and a pump, where the cooling plates capture deposition materials to maintain cleanliness and improve film characteristics, and the method involves ejecting deposition materials onto a substrate while moving the substrate or deposition source, using an evaporation unit to vaporize liquid materials, and processing cooling materials with a compressor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional deposition processes are used to form encapsulation layers, then the deposition films can be formed, but the deposition process cannot be effectively controlled and the film characteristics are not improved
Solution Approach 1:
The patent changes the temperature parameter by introducing cooling plates to cool the chamber wall surface, causing deposition materials to be captured on the cooled surface rather than forming on the substrate. This parameter change enables control over deposition film characteristics and prevents unwanted deposition on the substrate, resolving the contradiction between manufacturing precision and process reliability
Solution Approach 2:
The cooling plate acts as an intermediary element between the deposition source and the substrate. By introducing this intermediate cooling surface, the patent enables control over where deposition materials are captured, allowing precise control of encapsulation layer formation while maintaining reliable deposition process control
2Manufacturing precision
If deposition materials are ejected onto the substrate, then the encapsulation layer is formed, but deposition materials may contaminate the chamber and degrade pump performance
Solution Approach 1:
The patent extracts or removes deposition materials from the chamber environment by providing a dedicated cooling plate surface where materials are captured and removed from the deposition path. This prevents contamination of the chamber and protects pump performance while still enabling encapsulation layer formation on the substrate
Solution Approach 2:
The patent converts the potentially harmful effect of deposition materials contaminating the chamber into a beneficial effect by using the cooling plate to intentionally capture and control where materials deposit. The cooling plate transforms what would be contamination into a controlled deposition process, protecting the pump while maintaining encapsulation layer quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup enhances the cleanliness of the deposition environment, maintains pump performance, and improves the characteristics of deposition layers, leading to better electrical properties and image quality in organic light emitting display apparatuses.
Implementation Method 1
a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed
Implementation Method 2
an evaporation unit at an outside of the chamber and coupled to the deposition source. The evaporation unit may be configured to receive a deposition material of a liquid phase from a liquid phase material supply device, to vaporize the liquid phase deposition material
Implementation Method 3
a refrigerator contacting the cooling plate
Data Source
AI summary
A deposition apparatus configured to perform a deposition process on a substrate, the deposition apparatus including a chamber having an exhaust opening in a surface, a deposition source in the chamber configured to eject one or more deposition materials toward the substrate, a cooling plate corresponding to an inner surface of the chamber, at which the exhaust opening is formed, a refrigerator contacting the cooling plate, and a pump coupled to the exhaust opening.