Deposition Apparatus Curved Surface Encapsulation
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Solution Overview
Problem
Forming an encapsulating layer in organic light emitting display apparatuses is challenging due to interference from particles and surface irregularities, which can lead to malfunctions and requires a long time to achieve the desired thickness.
Innovation Solution
A deposition apparatus with a deposition source and a cooling stage that sprays and cools depositing materials, combined with a hardening unit that uses ultraviolet light to form a deposition layer with a curved surface, effectively covering particles and improving encapsulation quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulating layer is made thicker to cover particles, then encapsulation quality improves, but deposition time increases
Solution Approach 1:
The patent changes the temperature parameter of the substrate during deposition. By cooling the substrate to a temperature lower than the dew point of the depositing material, the material condenses rapidly forming a curved surface that covers particles effectively, achieving good encapsulation quality without requiring excessive thickness or time.
Solution Approach 2:
The patent utilizes phase transition of the depositing material from vapor to condensed state. By controlling the substrate temperature below the dew point, the depositing material undergoes rapid condensation and phase change, forming a curved surface morphology that naturally covers particles while maintaining thin layer thickness and short deposition time.
2Productivity
If the deposition layer is made thinner to reduce deposition time, then productivity improves, but particle coverage becomes insufficient
Solution Approach 1:
The patent changes the temperature parameter by cooling the substrate below the dew point of the depositing material. This parameter change causes rapid condensation and forms a curved surface morphology that provides excellent particle coverage even at thin layer thicknesses, enabling high productivity without sacrificing coverage quality.
Solution Approach 2:
The patent produces a curved surface (spheroidal morphology) in the deposition layer through controlled condensation on the cooled substrate. This curved surface structure naturally conforms to and covers particles effectively, allowing thin layers to achieve sufficient particle coverage while maintaining fast deposition speed.
3Ease of manufacture
If conventional deposition methods are used, then the process is simple, but particles remain exposed causing malfunctions
Solution Approach 1:
The patent introduces a temperature parameter change by cooling the substrate below the dew point of the depositing material. This simple parameter adjustment transforms the deposition process to produce curved surface morphology that effectively covers particles, ensuring device functionality while maintaining process simplicity.
Solution Approach 2:
The patent creates a curved surface structure in the deposition layer through controlled condensation. This curved morphology naturally adapts to cover particles on the substrate surface, preventing device malfunctions caused by exposed particles while keeping the manufacturing process straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient coverage of particles, preventing malfunctions and improving the encapsulation quality by restraining the fluidity of the depositing materials, resulting in a deposition layer that functions as intended without exposing particles.
Implementation Method 1
a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate
Implementation Method 2
a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. The hardening unit may be configured to radiate ultraviolet light toward the substrate
Implementation Method 3
a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate
Data Source
AI summary
A deposition apparatus is configured to form a deposition layer on a substrate. The deposition apparatus includes a deposition source configured to face a first side of the substrate and to spray one or more depositing materials toward the substrate, a cooling stage configured to support a second side of the substrate that is opposite from the first side of the substrate, and a hardening unit configured to harden the one or more depositing materials sprayed from the deposition source and that have reached the substrate. A method of forming a thin film deposition layer on a substrate by using a deposition apparatus is also provided. The method includes spraying one or more depositing materials toward the substrate by using a deposition source of the deposition apparatus while the substrate is on a cooling stage of the deposition apparatus.