Deposition Thickness Drift Compensation via Recipe Feedback Control
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Solution Overview
Problem
Existing substrate manufacturing processes face challenges in compensating for deposition thickness drift due to variations in processing chamber conditions, leading to inefficiencies, defects, and unscheduled downtime, as manual adjustments are time-consuming and error-prone.
Innovation Solution
A processing device uses machine learning to determine expected residual thickness values and adjusts film deposition parameters based on these values to generate an updated recipe, automating the compensation for deposition thickness drift.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual adjustments are used to compensate for deposition thickness drift, then some compensation can be achieved, but the process is time-consuming and error-prone
Solution Approach 1:
The patent replaces manual mechanical adjustment processes with an automated computer-controlled system. The system uses a processor to calculate compensation values based on measured thickness data and automatically adjusts deposition parameters, eliminating manual intervention and its associated time losses and human errors.
Solution Approach 2:
The system performs self-correction by automatically measuring deposition thickness, calculating compensation values, and adjusting parameters without external intervention. The processor uses feedback from thickness measurements to autonomously optimize subsequent deposition operations, making the system self-regulating.
2Manufacturing precision
If manual calculations are performed for compensation, then adjustments can be made, but errors are introduced and throughput is reduced
Solution Approach 1:
The patent replaces manual calculation processes with automated computational algorithms executed by a processor. The system rapidly computes compensation values based on measured data and deposits this information into the recipe database, eliminating manual calculation errors and significantly reducing the time required for parameter adjustment, thus maintaining high manufacturing throughput.
Solution Approach 2:
The system performs compensation calculations and parameter adjustments in advance before the next deposition operation begins. By pre-calculating compensation values based on previous measurement data and updating the recipe database proactively, the system ensures precise thickness control is ready before production continues, avoiding delays.
3Productivity
If automated compensation is implemented, then productivity increases, but system complexity increases
Solution Approach 1:
The patent implements a feedback control loop where deposition thickness is measured, compared against target values, and used to automatically adjust subsequent deposition parameters. The processor continuously receives thickness data, calculates compensation values, and updates the recipe database, creating a closed-loop system that maintains precision while operating autonomously.
Solution Approach 2:
The system introduces a processor and recipe database as intermediary components between the measurement system and the deposition control system. These intermediaries automatically translate thickness measurements into compensation parameters and manage the recipe updates, simplifying the overall control architecture while enabling automated compensation functionality.
Data Source
AI summary
A method includes identifying a material associated with a substrate processing operation of a recipe. The method further includes determining an expected total residual thickness value subsequent to the substrate processing operation. The method further includes determining, based on the expected total residual thickness value, an expected material thickness value of the material associated with the substrate processing operation. The method further includes updating the recipe based on the material and the expected material thickness value of the material to generate an updated recipe. The method further includes causing a substrate to be processed based on the updated recipe.