Deposition Head Control Plate for Maskless OLED Thin Film Formation
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Solution Overview
Problem
The formation accuracy of thin films in OLED display devices is compromised due to processing inaccuracies and deformation of fine masks used in vapor deposition, necessitating a technology to deposit thin films without relying on these masks.
Innovation Solution
A deposition device and method featuring a stage, deposition heads with nozzles emitting vapor, and a control plate with sleeves to regulate the deposition angle, allowing for precise control over the vapor distribution and deposition on a substrate with a rib and partition structure, enabling the deposition of materials without the need for a fine mask.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fine mask is applied for vapor deposition, then the deposition area can be controlled, but the formation accuracy of the thin film deteriorates due to processing inaccuracies and deformation of the mask
Solution Approach 1:
The patent removes the fine mask from the deposition system entirely. Instead of using a mask to define the deposition area, the invention uses a rib structure on the substrate and controls vapor deposition through the geometry of the rib and partition structures, eliminating mask-related processing inaccuracies and deformations.
Solution Approach 2:
The patent introduces a rib structure and partition structures as intermediary elements between the deposition source and the substrate. These structures serve as physical guides that control vapor deposition patterns without requiring a separate mask layer, thereby improving formation accuracy while reducing device complexity.
2Area of stationary object
If a fine mask is used to deposit thin films in desired areas, then area control is achieved, but the mask undergoes deformation and processing inaccuracies
Solution Approach 1:
The patent transitions from two-dimensional mask patterning to three-dimensional structural control. By using ribs and partitions that extend vertically from the substrate, the system controls deposition area through the spatial geometry of these structures rather than through planar mask apertures, eliminating aperture shape deformation issues.
Solution Approach 2:
The fine mask is completely removed from the system. Area control is achieved through the rib and partition structures that are integral to the substrate architecture, eliminating the source of aperture shape inaccuracies and mask processing errors.
3Manufacturing precision
If vapor deposition is performed without a mask, then mask-related errors are eliminated, but control over deposition distribution and angle becomes more difficult
Solution Approach 1:
The rib and partition structures serve as intermediary elements that facilitate deposition control without requiring a mask. These structures guide the vapor deposition process by providing physical boundaries and geometric constraints that control material distribution and deposition angles, maintaining ease of operation while improving precision.
Solution Approach 2:
The patent applies different geometric characteristics to different regions of the substrate through the rib and partition structures. Each region's deposition characteristics are controlled by the local geometry of these structures, allowing precise control over deposition distribution and angle in different areas without complex mask patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the formation accuracy of thin films by controlling the deposition angle and distribution, ensuring precise deposition over the substrate, thereby improving the overall quality and precision of the OLED display device.
Implementation Method 1
a deposition source heating a material and generating vapor
Implementation Method 2
a nozzle connected to the deposition source to emit the vapor generated by the deposition source
Implementation Method 3
depositing a first material on the processing substrate
Data Source
AI summary
According to one embodiment, a deposition device includes a stage, a deposition head opposed to the stage, and a chamber accommodating the stage and the deposition head. The deposition head comprises a deposition source heating a material and generating vapor, a nozzle connected to the deposition source to emit the vapor generated by the deposition source, a control plate comprising a sleeve surrounding the nozzle, and a movement mechanism moving the control plate along an extension direction of the sleeve.