Deposition Mask Structure for Ultrasonic Cleaning Durability
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Solution Overview
Problem
Deposition masks used in organic EL display devices face deformation and potential breakage during ultrasonic cleaning due to reduced strength and cavitation, especially when designed for high pixel density and aperture ratio, leading to reduced utilization efficiency of deposition material.
Innovation Solution
A deposition mask with a specific metal layer structure and plating process is developed, featuring a metal layer with a first portion and a second portion of varying thickness and shape to enhance strength and prevent deformation, allowing for precise control of through-hole dimensions and material deposition efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the aperture ratio of the deposition mask is increased or the thickness is decreased to increase pixel density, then the pixel density and aperture ratio performance is improved, but the strength of the deposition mask is lowered making it susceptible to deformation and breakage during ultrasonic cleaning
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness and material composition of the deposition mask to achieve the desired pixel density while maintaining sufficient strength. Specifically, the mask thickness is controlled within a precise range (10-20 μm) and material parameters are adjusted to balance aperture ratio requirements with mechanical strength needs, resolving the contradiction between high pixel density and structural integrity during ultrasonic cleaning
Solution Approach 2:
The patent employs composite materials by using a multi-layer structure consisting of a support layer and a patterned metal layer. This composite construction provides both the high aperture ratio needed for pixel density and the mechanical strength required to withstand ultrasonic cleaning, as the support layer reinforces the thin patterned layer without significantly reducing the aperture ratio
2Object-generated harmful factors
If ultrasonic cleaning is performed to remove adhering deposition material, then the cleanliness of the deposition mask is improved, but deformation and breakage occur due to cavitation and reduced strength
Solution Approach 1:
The patent applies beforehand cushioning by designing a reinforced mask structure with optimized thickness and material properties prior to ultrasonic cleaning. The mask is pre-strengthened through controlled thickness (10-20 μm) and material selection to withstand the cavitation forces during cleaning, preventing deformation and breakage while still allowing effective removal of adhering deposition material
Solution Approach 2:
The patent changes material parameters and structural dimensions to enhance the mask's resistance to ultrasonic cleaning damage. By optimizing the thickness within a specific range and adjusting material composition, the mask achieves sufficient strength to withstand cavitation forces while maintaining the ability to be cleaned effectively, resolving the contradiction between cleanliness and structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses deformation during ultrasonic cleaning, maintains the mask's strength, and enhances the utilization efficiency of deposition material, enabling the production of high-definition organic EL display devices with improved durability.
Implementation Method 1
a plating solution is supplied to the gap of the resist pattern to precipitate a metal layer on the base material by an electrolytic plating process
Data Source
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AI summary
A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies z ≥ 3.7 and z ≥ 0.1x - 6.0 when an indentation elastic modulus is x (GPa) and an indentation hardness is z (GPa).