Deposition Mask Conductive Patterns Electrostatic Holding
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Solution Overview
Problem
Existing mask technologies face challenges in achieving reliable deposition processes with high yield and precision, often resulting in shadow issues and increased process time and cost due to inadequate holding strength and deposition precision.
Innovation Solution
A deposition mask with a polymer mask film and a conductive layer featuring spaced-apart first and second conductive patterns, which provide an electrostatic chuck function to enhance holding strength and prevent shadow issues, is used. The mask film is made of polyimide, and the conductive layer includes metals like nickel, gold, and indium tin oxide, with the conductive patterns arranged to ensure precise alignment with deposition openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional mask without electrostatic chuck function is used, then the mask structure is simple, but the holding strength is insufficient and shadow issues occur in deposition process
Solution Approach 1:
The conductive layer is designed to serve dual functions: as an electrostatic chuck for holding the mask film to the substrate and as a structural component of the mask. By integrating these two functions into a single layer, the patent increases holding strength without proportionally increasing structural complexity, resolving the contradiction between strength and device complexity.
Solution Approach 2:
The mask structure combines a polymer mask film with a conductive layer (which can be made of metals like nickel, gold, or conductive metals oxide like ITO, IZO). This composite structure allows the conductive layer to provide both mechanical support and electrostatic chuck functionality, improving holding strength while maintaining reasonable structural complexity through material composition rather than adding separate components.
2Manufacturing precision
If conventional mask technology is used, then manufacturing process is simpler, but deposition precision is poor due to shadow issues
Solution Approach 1:
The patent replaces mechanical holding methods with electrostatic attraction to secure the mask film to the substrate. The electrostatic chuck function, achieved through voltage application to the conductive layer, provides precise and stable holding without complex mechanical adjustment mechanisms, thereby improving deposition precision while keeping the manufacturing process relatively simple.
Solution Approach 2:
The patent controls deposition precision by adjusting electrostatic parameters (voltage magnitude and distribution) rather than relying solely on mechanical positioning. By changing electrical parameters to optimize holding strength and mask-substrate contact, the system achieves better deposition precision without proportionally increasing manufacturing complexity.
3Ease of manufacture
If mask film is made of polymer material, then ease of manufacture is improved, but holding strength is insufficient
Solution Approach 1:
The conductive layer acts as an intermediary between the polymer mask film and the substrate. It transfers electrostatic forces to hold the lightweight polymer film firmly against the substrate, compensating for the polymer's inherent weakness in providing holding strength while maintaining the ease of manufacture advantages of using polymer materials.
Solution Approach 2:
By combining polymer mask film with a conductive layer (metal or conductive metal oxide), the patent creates a composite structure where the polymer provides ease of manufacture benefits while the conductive layer provides the necessary holding strength through electrostatic chuck functionality, resolving the contradiction between ease of manufacture and holding strength.
4Reliability
If conventional deposition mask is used, then process time is longer, but reliability is lower due to shadow problems
Solution Approach 1:
The electrostatic chuck function enables faster and more reliable mask-substrate contact compared to conventional mechanical methods. By using electrical fields to achieve immediate and uniform holding, the patent reduces the time required for mask positioning and contact, thereby decreasing process time while improving reliability through consistent electrostatic attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces shadow issues and improves deposition precision, leading to increased reliability and reduced process time and cost, while maintaining high durability and chemical resistance.
Implementation Method 1
The conductive layer receives the power at the first conductive pattern and the second conductive pattern, and receipt of the power at the first conductive pattern and the second conductive pattern provides an electrostatic chuck function of the deposition mask
Data Source
AI summary
A deposition mask includes a mask film including a polymer, a plurality of first deposition openings defined in the mask film. and a conductive layer which is on the mask film and receives a power. The conductive layer includes a first conductive pattern and a second conductive pattern spaced apart from each other along the mask film and electrically disconnected from each other. The conductive layer receives the power at the first conductive pattern and the second conductive pattern, and receipt of the power at the first conductive pattern and the second conductive pattern provides an electrostatic chuck function of the deposition mask.