Deposition Mask Frame Structure for Thin-Mask Accuracy and Handling
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Solution Overview
Problem
Vapor deposition masks with thinner designs face challenges in achieving both pattern accuracy and mechanical durability, making them difficult to handle effectively.
Innovation Solution
A method for manufacturing vapor deposition masks using a metal plate made of an iron-nickel alloy, sandwiched with a plastic layer between a glass substrate, and supported by a rigid mask frame, which allows for thinner mask portions while maintaining mechanical strength and accuracy through a laser peeling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the vapor deposition mask is made thinner to improve pattern accuracy, then the distance between openings is reduced improving pattern accuracy, but mechanical durability is insufficient making handling difficult
Solution Approach 1:
The vapor deposition mask is divided into two functional parts: a thin mask portion (0.5-5 μm) containing the mask holes for high-resolution patterning, and a separate mask frame (5-50 μm) providing mechanical strength. This segmentation allows each part to be optimized independently - the mask portion for pattern accuracy and the mask frame for durability and handling.
Solution Approach 2:
The thin mask portion is positioned within and supported by the mask frame structure. The mask portion is sandwiched between a support substrate and the mask frame, creating a nested configuration where the fragile thin component is protected by the robust frame structure, enabling both high precision and mechanical durability.
2Manufacturing precision
If the mask portion is made thinner to reduce distance between openings, then pattern accuracy improves, but handleability deteriorates
Solution Approach 1:
The mask system is segmented into a thin mask portion for precision and a thick mask frame for ease of handling. The mask frame serves as a handleable structure that protects and positions the fragile thin mask portion, allowing operators to handle the assembly without directly touching the delicate mask portion.
Solution Approach 2:
The mask frame acts as an intermediary structure between the operator and the thin mask portion. When handling is required, the operator interacts with the robust mask frame while the thin mask portion remains protected within the frame structure, eliminating direct handling of the fragile component.
3Ease of manufacture
If external forces are applied during peeling to separate layers, then manufacturing process is simplified, but mask holes deform reducing pattern accuracy
Solution Approach 1:
The mechanical peeling process is replaced with a chemical solution-based separation method. The plastic layer is designed to be soluble in specific chemical solutions, allowing layers to be separated through chemical dissolution rather than mechanical force, thereby avoiding deformation of the mask holes while achieving layer separation.
Solution Approach 2:
The separation mechanism is changed from mechanical to chemical by selecting a plastic layer with specific solubility characteristics. By changing the separation parameter from applied force to chemical concentration and exposure time, the process achieves layer separation without the harmful mechanical stresses that would deform the mask holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy of pattern formation and handleability of vapor deposition masks by reducing external forces during peeling, maintaining mechanical strength, and minimizing deformation of mask holes.
Implementation Method 1
peeling off the glass substrate from the plastic layer by irradiating an interface between the plastic layer and the glass substrate with a laser beam having a wavelength that passes through the glass substrate and is absorbed by the plastic layer
Implementation Method 2
a laser beam having a wavelength that passes through the glass substrate and is absorbed by the plastic layer
Implementation Method 3
peeling off the plastic layer from the mask portion by dissolving the plastic layer using a chemical solution after peeling off the glass substrate from the plastic layer
Data Source
AI summary
A method includes: sandwiching a plastic layer between a glass substrate and a metal plate made of an iron-nickel alloy and joining the metal plate to the glass substrate with the plastic layer in between; forming a mask portion including a plurality of mask holes from the metal plate; joining a surface of the mask portion that is opposite to a surface of the mask portion that is in contact with the plastic layer to a mask frame, which has a higher rigidity than the mask portion and is in a shape of a frame surrounding the mask holes of the mask portion; and peeling off the plastic layer and the glass substrate from the mask portion.