Deposition Mask Laser Hole Formation with a Reflective Sacrificial Layer
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Solution Overview
Problem
Existing deposition mask manufacturing processes are inefficient, particularly in forming precise patterns with high precision and minimizing defects such as dust oxide films.
Innovation Solution
A method involving a mask-target substrate with a sacrificed layer pattern that has higher reflectance than the substrate, using lasers to form holes, followed by selective etching to remove the sacrificed layer and oxide films, enhancing precision and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional deposition mask manufacturing processes are used, then the manufacturing process is simpler, but the manufacturing efficiency is low and production time is long
Solution Approach 1:
A sacrificial layer is deposited on the mask substrate before laser processing. This preliminary layer reflects laser light during hole formation, preventing direct laser exposure to the substrate and enabling more efficient material removal while reducing processing time and improving manufacturing efficiency
Solution Approach 2:
The sacrificial layer acts as an intermediary between the laser and the mask substrate. It mediates the energy transfer by reflecting laser light, which accelerates the hole formation process and improves overall manufacturing efficiency without requiring complex process changes
2Manufacturing precision
If conventional laser processing is used without a sacrificial layer, then the process is simpler, but dust oxide films are generated on the mask substrate surface
Solution Approach 1:
The sacrificial layer, which initially seems to add complexity, actually prevents the harmful formation of dust oxide films on the mask substrate. By reflecting laser light, it converts potentially harmful direct laser-substrate interaction into a beneficial process that protects surface quality
Solution Approach 2:
The sacrificial layer serves as a protective intermediary that prevents direct laser exposure to the mask substrate surface, thereby preventing dust oxide film formation and improving surface quality and manufacturing precision
3Productivity
If the sacrificial layer has high reflectance to laser light, then hole formation efficiency is improved, but the laser energy absorption by the substrate is reduced
Solution Approach 1:
The high reflectance of the sacrificial layer causes laser light to bounce back and forth between the layer and the substrate, effectively 'skipping' through the interface multiple times. This increases the effective energy interaction and accelerates hole formation speed, improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves manufacturing efficiency by reducing the time required to form precise patterns and minimize defects, such as dust oxide films, thereby improving the quality and speed of deposition mask production.
Implementation Method 1
forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate
Implementation Method 2
a reflectance of the sacrificed layer pattern with respect to the laser is higher than a reflectance of the mask-target substrate with respect to the laser
Implementation Method 3
the removing the sacrificed layer pattern may be performed using a first etchant
Data Source
AI summary
A method of manufacturing a deposition mask includes preparing a mask-target substrate which has one surface on which a sacrificed layer pattern is formed and comprises a cover area covered by the sacrificed layer pattern and a plurality of exposed areas exposed by the sacrificed layer pattern; forming holes in the exposed areas of the mask-target substrate by emitting laser toward the mask-target substrate; and removing the sacrificed layer pattern, wherein the sacrificed layer pattern has a higher reflectance with respect to the laser than a reflectance of the mask-target substrate.