Deposition Mask Laser Scanning for Precise Pattern Hole Formation
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Solution Overview
Problem
The existing methods for forming pattern holes in deposition masks during the etching process face challenges in achieving precise dimensions and high working speed, often resulting in non-continuous protruding surfaces that can cause 'shadow' effects during deposition, leading to inaccurate patterning.
Innovation Solution
A method and apparatus that use laser beams to form pattern holes in a deposition mask by splitting and scanning the beams, with fine adjustments in irradiation states to match the shapes of the holes, eliminating the need for an etching process and allowing for accurate and quick formation of pattern holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching process is used to form pattern holes, then pattern holes can be formed, but manufacturing precision and working speed are insufficient
Solution Approach 1:
The patent replaces the mechanical etching process with a laser-based processing system. The laser beam directly ablates or melts the mask material to form pattern holes, eliminating the need for chemical etchants and complex etching equipment. This substitution enables both high precision (controlled by laser parameters) and high speed (continuous scanning capability), resolving the contradiction between precision and productivity.
Solution Approach 2:
The patent utilizes adjustable laser parameters (power, pulse duration, scanning speed, beam diameter) to precisely control the pattern hole formation process. By dynamically changing these parameters during processing, the system can optimize both the precision of hole dimensions and the speed of fabrication, overcoming the limitations of fixed etching processes.
2Productivity
If etching starts from both side surfaces, then pattern holes can be formed, but non-continuous protruding surfaces appear causing shadow effects
Solution Approach 1:
Instead of etching from both sides toward the center (which causes meeting points and protrusions), the laser processing method effectively inverts the approach by creating holes from the surface downward in a controlled sequence. The laser scans and removes material layer by layer or in direct paths, ensuring continuous hole formation without intermediate protruding surfaces that would cause shadow effects during subsequent deposition.
3Productivity
If multiple laser beams are used for scanning, then productivity increases, but control complexity increases
Solution Approach 1:
The patent employs a single laser source that can generate multiple beams through optical splitting, or alternatively uses one laser beam with rapid scanning capability to process multiple locations. This multi-functional approach achieves the productivity of multiple simultaneous beams while avoiding the complexity of controlling multiple independent laser systems. The single laser source can be dynamically directed to different positions or split into multiple beams that are independently controllable through optical elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the precise and efficient formation of pattern holes without etching, reducing the risk of 'shadow' effects and improving the productivity and quality of the final product by directly irradiating multiple laser beams onto the mask substrate.
Implementation Method 1
a hole processing process in which laser beams are irradiated onto the mask substrate to form a plurality of pattern holes
Implementation Method 2
a splitting process in which the irradiated laser beam is split into a plurality of laser beams
Data Source
AI summary
A method of manufacturing a deposition mask includes: a splitting process in which a laser beam irradiated from a light source is split into a plurality of laser beams; a scanning process in which the plurality of laser beams are simultaneously scanned onto the mask substrate; and a tuning process in which irradiation states of the plurality of laser beams are finely changed to correspond to shapes of the plurality of pattern holes while the plurality of laser beams are scanned.