Vacuum Chamber Deposition Plate Baking via Radiation Cooling
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Solution Overview
Problem
Existing vacuum processing apparatuses face challenges in performing baking processing of deposition preventive plates without impairing their cooling function, as the interposition of reflecting plates complicates cooling during the process.
Innovation Solution
A vacuum processing apparatus with a metal block body opposite to the deposition preventive plate, featuring high-emissivity layers on the surfaces for efficient heat transfer and a heating means between the block body and the plate, allowing for baking and cooling without a reflection plate, utilizing high-emissivity layers on the block body and deposition preventive plate surfaces for efficient heat absorption and radiation cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a reflecting plate is interposed between the heating means and the deposition preventive plate to perform baking processing, then the baking processing can be performed, but the cooling function of the deposition preventive plate is impaired
Solution Approach 1:
The invention extracts and removes the reflecting plate from the system. Instead of using a reflecting plate to direct heat to the deposition preventive plate, the heating means is positioned to directly face the plate, eliminating the reflecting plate while maintaining heating capability and preserving cooling function.
Solution Approach 2:
The deposition preventive plate is designed to serve multiple functions: it acts as both a deposition prevention surface and a cooling element. The plate's structure allows it to be heated for baking and cooled during operation, with cooling channels integrated directly into the plate to maintain its cooling function throughout the process.
2Object-generated harmful factors
If the deposition preventive plate is cooled during vacuum processing, then sputtered particles do not adhere to the inner wall surface, but the plate temperature rises with increased number of substrates
Solution Approach 1:
The invention changes the thermal parameters of the deposition preventive plate by integrating cooling channels that circulate cooling medium. This allows dynamic control of the plate temperature, maintaining it at levels that prevent sputtered particle adhesion even when processing multiple substrates, by actively removing heat generated during operation.
3Reliability
If the deposition preventive plate is heated for baking processing, then gases are removed from the plate, but the heating process complicates the system structure
Solution Approach 1:
The invention merges the heating function with the existing cooling structure. The heating means is integrated into the same structural framework that houses the cooling channels, combining thermal management functions (heating for baking and cooling for operation) into a unified system without adding separate complex heating structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient baking processing of the deposition preventive plate while maintaining its cooling functionality through radiation cooling, eliminating the need for a reflection plate and ensuring effective heat transfer during vacuum processing.
Implementation Method 1
heating means disposed between a part of the deposition preventive plate and the block body so as to be capable of heating the deposition preventive plate by heat radiation
Implementation Method 2
high-emissivity layers having an increased emissivity as a result of surface treatment to parent metal of the block body and the deposition preventive plate, respectively
Implementation Method 3
cooling means for cooling the block body
Implementation Method 4
the target gets sputtered; the sputtered particles splashed from the target get adhered to, and deposited on, the surface of the to-be-processed substrate
Data Source
AI summary
Provided is a vacuum processing apparatus which is capable of performing baking processing of a deposition preventive plate without impairing the function of being capable of cooling the deposition preventive plate disposed inside a vacuum chamber. The vacuum processing apparatus has a vacuum chamber for performing a predetermined vacuum processing on a to-be-processed substrate that is set in position inside the vacuum chamber. A deposition preventive plate is disposed inside the vacuum chamber. Further disposed are: a metallic-made block body vertically disposed on an inner surface of the lower wall of the vacuum chamber so as to lie opposite to a part of the deposition preventive plate with a clearance thereto; a cooling means for cooling the block body; and a heating means disposed between the part of the deposition preventive plate and the block body to heat the deposition preventive plate by heat radiation.