Deposition Apparatus Shutter Storage Exhaust Path
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Solution Overview
Problem
Conventional plasma processing apparatuses experience pressure fluctuations in the vacuum chamber due to changes in exhaust conductance caused by the opening and closing of the shutter, leading to unstable plasma conditions during deposition.
Innovation Solution
A deposition apparatus with a shutter storage unit connected to the exhaust chamber via a first exhaust path, which stabilizes the pressure by minimizing changes in exhaust conductance, allowing the shutter to operate without disrupting the plasma stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the shutter is opened or closed to control deposition timing, then the deposition controllability is improved, but the exhaust conductance changes causing pressure fluctuations and plasma instability
Solution Approach 1:
The exhaust system is segmented into multiple independent exhaust paths (first exhaust path and second exhaust path). The first exhaust path connects the vacuum chamber to the exhaust chamber and remains open during shutter operations. The second exhaust path provides an additional exhaust route that compensates for conductance changes when the shutter opens or closes. This segmentation allows the exhaust system to maintain stable pressure despite shutter movements.
Solution Approach 2:
The shutter storage unit acts as an intermediary component between the shutter and the vacuum chamber. When the shutter needs to be stored or retrieved, it moves through the shutter storage unit which is connected to the exhaust chamber via the first exhaust path. This intermediary structure allows the shutter to be positioned without directly affecting the main vacuum chamber pressure, as the shutter operations occur in the exhaust chamber environment rather than the vacuum chamber.
2Manufacturing precision
If the shutter is moved to shield or expose the substrate holder and deposition unit, then the deposition timing control is improved, but the exhaust conductance fluctuates affecting pressure stability
Solution Approach 1:
The exhaust system is divided into multiple independent paths to isolate the effects of shutter movement. The first exhaust path maintains a constant connection between the vacuum chamber and exhaust chamber, providing a stable baseline exhaust conductance. The second exhaust path provides additional capacity to absorb conductance variations caused by shutter positioning, ensuring pressure stability during deposition timing control operations.
Solution Approach 2:
The system changes the exhaust conductance parameter dynamically by utilizing multiple exhaust paths with different conductance characteristics. When the shutter moves and blocks part of the first exhaust path, the second exhaust path compensates by providing alternative gas flow routes. This parameter change approach allows the overall exhaust conductance to remain relatively constant despite local changes caused by shutter movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-quality deposition by maintaining stable plasma conditions, even when the shutter is opened or closed, thereby improving the controllability and quality of the deposited film.
Implementation Method 1
an exhaust device connected to the exhaust chamber and evacuates the processing chamber via the exhaust chamber
Implementation Method 2
a deposition unit disposed in the processing chamber and deposits a film on the substrate
Implementation Method 3
a shutter configured to move to a shielding state in which the shutter shields the substrate holder and the deposition unit from each other, or a retracted state in which the shutter is retracted from between the substrate holder and the deposition unit
Data Source
AI summary
A deposition apparatus includes a shutter storage unit which is connected to a processing chamber via an opening and stores a shutter in the retracted state into an exhaust chamber, and a shield member which is formed around the opening of the shutter storage unit and covers the exhaust port of the exhaust chamber. The shield member has, at a position of a predetermined height between the opening of the shutter storage unit and a deposition unit, the first exhaust path which communicates with the exhaust port of the exhaust chamber.