Deposition Source Angle Limiter for Uniform OLED Deposition
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Solution Overview
Problem
Existing deposition methods for organic light-emitting display devices struggle to maintain a high incidence angle of deposition materials and ensure uniformity on the substrate, leading to non-uniform deposition patterns.
Innovation Solution
A deposition source with a crucible, deposition nozzle, and angle limiter configuration that controls the emission angle of deposition materials, allowing for precise control of deposition material distribution and ensuring uniformity on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional deposition source is used, then the deposition process is simple, but the incidence angle of deposition material cannot be maintained at a high level and uniformity on the substrate cannot be ensured
Solution Approach 1:
The deposition source is divided into multiple functional components: crucible for material storage, deposition nozzle for controlled discharge, support plate for positioning, and angle limiter for angle control. This segmentation allows each component to perform its specific function optimally, achieving high incidence angle and uniform deposition while maintaining clear functional separation.
Solution Approach 2:
The angle limiter acts as an intermediary component between the deposition nozzle and the substrate. It controls and limits the emission angle of deposition material through its geometric structure, ensuring that material reaches the substrate at the desired high incidence angle while preventing excessive angular deviation that would compromise uniformity.
2Manufacturing precision
If the emission angle is not controlled, then the device structure is simple, but the deposition material distribution becomes non-uniform on the substrate
Solution Approach 1:
The angle limiter controls the emission angle parameter of deposition material by its geometric configuration. By adjusting the shape, size, and position of the angle limiter, the emission angle can be precisely controlled to maintain high incidence angle, ensuring uniform material distribution on the substrate without requiring complex active control systems.
3Manufacturing precision
If the incidence angle is increased to improve deposition uniformity, then material distribution improves, but the control difficulty of the deposition source increases
Solution Approach 1:
The angle limiter is designed as a passive geometric constraint that automatically controls the emission angle based on its physical structure. The deposition material naturally follows the path defined by the angle limiter's geometry, eliminating the need for complex active control mechanisms or sophisticated operation systems while maintaining high incidence angle and uniform deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration maintains a high incidence angle and ensures uniform deposition of materials on the substrate, improving the quality and consistency of organic light-emitting display devices.
Implementation Method 1
As the crucible is heated, the deposition material vaporizes and can be emitted through the deposition nozzle
Implementation Method 2
an angle limiter disposed on the support plate, where an emission angle of the deposition material discharged from the deposition nozzle is restricted by the angle limiter
Implementation Method 3
a vacuum deposition method can be employed to deposit organic materials or metals used as electrodes onto a substrate
Data Source
AI summary
A deposition source includes a crucible accommodating a deposition material and having an open top, a cover plate covering the open top of the crucible, a deposition nozzle disposed on the cover plate, where the deposition nozzle discharges the deposition material, a support plate extending upwardly from the cover plate, and an angle limiter disposed on the support plate. An angle-limiting hole, through which the deposition material passes, is defined in the angle limiter, and a first line extending from one side of the deposition nozzle to a top of the angle-limiting hole is longer than a second line extending from the one side of the deposition nozzle to a point where an imaginary line extending from one side of the angle-limiting hole to the cover plate and an imaginary line extending from the one side of the deposition nozzle parallel to the cover plate meet each other.