Deposition Source With Hardening Portion For OLED Film
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Solution Overview
Problem
The challenge in manufacturing organic light-emitting displays is the difficulty in improving the characteristics of the deposited film and encapsulation characteristics due to contamination and damage caused by encapsulation members and impurities, which limits the effectiveness of existing encapsulation processes.
Innovation Solution
A deposition source and apparatus that includes a nozzle for discharging deposition material onto a substrate, with hardening portions that immediately harden the material upon reaching the substrate, using UV or visible light to prevent contamination and ensure desired film characteristics, allowing for the formation of both inorganic and organic encapsulation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation members are formed to prevent contamination and damage, then protection and reliability are improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent combines the deposition and hardening processes into a single integrated operation. The deposition source simultaneously deposits material and the hardening portion immediately hardens it upon reaching the substrate, eliminating the need for separate encapsulation layer formation processes and reducing manufacturing complexity while maintaining protection reliability
Solution Approach 2:
The hardening portion is positioned to immediately harden the deposition material as it reaches the substrate, performing the hardening action in advance before the material can contaminate or damage other components. This preliminary hardening action prevents contamination without requiring complex post-processing encapsulation steps
2Manufacturing precision
If deposition material is discharged onto substrate, then film formation is achieved, but contamination and impurities reduce manufacturing precision
Solution Approach 1:
The patent extracts and removes the harmful contamination issue by immediately hardening the deposition material upon it reaching the substrate. This prevents the material from remaining in a vulnerable state that could be contaminated by encapsulation members or other impurities, thereby maintaining manufacturing precision
Solution Approach 2:
The deposition material is rapidly deposited and immediately hardened in a continuous process, rushing through the potential contamination window. The hardening portion acts quickly to solidify the material before it can be affected by harmful factors, ensuring clean film formation without requiring complex protective measures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the characteristics of the deposited film and prevents contamination by rapidly hardening the deposition material, ensuring uniformity and desired properties of the organic light-emitting display, while allowing for effective encapsulation layer formation.
Implementation Method 1
The hardening portion may harden the deposition material by emitting ultraviolet (UV) light.
Implementation Method 2
The hardening portion may harden the deposition material by emitting visible light.
Implementation Method 3
The deposition source may further include a crucible accommodating the deposition material, wherein the nozzle is connected to the crucible.
Data Source
AI summary
A deposition source for depositing a deposition material on a substrate, the deposition source including: a nozzle disposed to face the substrate and discharge the deposition material toward the substrate; and a hardening portion disposed to at least one side of the nozzle for immediately hardening the deposition material discharged via the nozzle when the deposition material reaches the substrate. The deposition source being part of a deposition apparatus for manufacturing an organic light-emitting display having improved characteristics of a deposited film and encapsulation characteristics.