Deposition Source Layout for Material Separation and Uniform Thin Films
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Solution Overview
Problem
Existing deposition methods fail to prevent mixing of different deposition materials within the deposition source and achieve uniform deposition on target substrates.
Innovation Solution
A deposition source design featuring separate storage compartments for different materials, each with its own heater and cover, and a partition wall to maintain material separation, along with an adiabatic plate to control temperature, ensuring independent material paths and uniform deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate storage compartments and partition walls are used to prevent mixing of deposition materials, then material separation is improved, but device complexity increases
Solution Approach 1:
The deposition source is divided into multiple independent storage compartments (first storage, second storage) with separate partition walls. Each compartment can store different deposition materials independently, preventing mixing while maintaining a modular structure that manages complexity through functional segmentation.
Solution Approach 2:
The cover structure is designed to overlap and cover multiple storage compartments simultaneously. The first cover overlaps the first storage while the second cover overlaps the second storage, creating a nested arrangement where the cover system encapsulates the segmented storage units, providing protection and structural integration.
2Manufacturing precision
If multiple separate storage compartments and covers are used to maintain material independence, then deposition uniformity is improved, but device complexity increases
Solution Approach 1:
The deposition source employs segmented storage compartments with individual covers and partition walls. This segmentation allows independent control and uniform deposition of each material type while maintaining overall system integration through the overlapping cover design.
Solution Approach 2:
Each storage compartment and its corresponding cover are designed with specific local characteristics. The first cover specifically covers the first storage compartment, and the second cover specifically covers the second storage compartment. This localized design ensures that each material deposition path is optimized independently while contributing to overall uniformity.
3Reliability
If partition walls and separate paths are implemented to prevent material mixing, then material purity is improved, but device complexity increases
Solution Approach 1:
The deposition source is segmented into distinct material paths using partition walls that physically separate the first storage and second storage compartments. This segmentation ensures that deposition materials travel through independent paths from their respective storage locations to the deposition zone, preventing cross-contamination and maintaining material purity.
Solution Approach 2:
The harmful mixing of deposition materials is extracted and prevented by introducing partition walls and separate storage compartments. Each material is isolated in its own compartment with its own cover and path, removing the possibility of contamination that would occur in a unified storage system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents mixing of deposition materials and enables uniform deposition on target substrates, enhancing the quality and consistency of thin film formation.
Implementation Method 1
a heater disposed in the housing, and that heats the deposition material received in the storage
Implementation Method 2
a deposition material of the deposition source is deposited onto the target substrate by sublimation or vaporization
Implementation Method 3
a deposition material of the deposition source is deposited onto the target substrate by sublimation or vaporization
Implementation Method 4
there is a vacuum deposition method in which a thin film is formed by depositing a certain material in a vacuum atmosphere
Implementation Method 5
an adiabatic plate disposed in the housing protrusion
Data Source
AI summary
A deposition source may include: a housing; a nozzle component disposed on the housing, and including a first nozzle and a second nozzle adjacent to the first nozzle; a first storage disposed in the housing and that receives a first deposition material; a second storage disposed in the housing and that receives a second deposition material; and a cover disposed between the housing and the nozzle component, and including a first cover and a second cover. The first cover may overlap the first storage without overlapping the second storage, in a plan view.