Depressed Board Surface for Support Pillars in Electronic Devices
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Solution Overview
Problem
The existing electronic device configuration with through holes and connection electrodes on the surface of the circuit board limits the region for mounting electronic components and forming wiring patterns, restricting the types and number of components that can be included and complicating the wiring process.
Innovation Solution
The electronic device features a first board with depressed portions on its surface for support pillars, allowing these pillars to be inserted without passing through the board, which enables increased space for mounting components and forming wiring patterns, and uses a conductive metal film and extraction electrodes for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If through holes and connection electrodes are disposed on the surface of the electronic circuit board, then the support pillar can be locked with the board, but the region for mounting electronic components and forming wiring pattern is reduced
Solution Approach 1:
The support pillar is designed to extend in the thickness direction (vertical dimension) of the electronic circuit board, with its distal end positioned at a specific height above the board surface. This vertical positioning allows the pillar to provide structural support and locking function without occupying horizontal space on the board surface, thereby resolving the conflict between locking strength and mounting area.
2Reliability
If through holes and connection electrodes are disposed on predetermined positions, then the support pillar can be bonded to the board, but the wiring pattern formation becomes difficult and component selection is limited
Solution Approach 1:
The support pillar function is extracted from the traditional through-hole connection system. Instead of using through holes that pass completely through the board and require surface-mounted connection electrodes, the pillar is positioned vertically above the board surface, separating the support function from the wiring plane and enabling more flexible circuit design.
3Length of stationary object
If the distal end portion of the support pillar projects from the board surface, then the pillar can provide structural support, but the through holes and connection electrodes still occupy valuable surface space
Solution Approach 1:
The support pillar utilizes the vertical dimension (thickness direction) of the electronic circuit board to provide structural support. By positioning the distal end at a specific height above the board surface rather than spreading support structures across the horizontal plane, the design maximizes the available surface area for mounting components and forming wiring patterns while maintaining adequate support functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the area available for mounting components and designing wiring patterns, allowing for a greater variety of components and shorter wiring routes, reducing signal deterioration and manufacturing costs.
Implementation Method 1
the support pillar is bonded to the electronic circuit board via a conductive adhesive disposed on a peripheral surface of the distal end portion and on the connection electrode
Data Source
AI summary
An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.