Depth Camera Module Diffuser Mounting to Avoid SMT Contamination
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Solution Overview
Problem
The existing camera module designs face challenges in manufacturing cost increases due to design changes, contamination from SMT processes, and collisions between wire-bonding apparatus grippers and components during wire bonding.
Innovation Solution
A camera module design that includes a light emitter, light receiver, diffusion unit, printed circuit board, and stiffener, where the diffusion unit is coupled to the case rather than the light emitter, allowing for design flexibility without increasing manufacturing costs and minimizing contamination and component damage during wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the diffusion unit is coupled to the light emitter, then the structure is compact, but design changes increase manufacturing costs and cause contamination
Solution Approach 1:
The diffusion unit is separated from the light emitter and coupled to the case instead, creating independent modules. This segmentation allows the diffusion unit to be designed and manufactured separately, reducing manufacturing costs when design changes are needed while maintaining the overall compact structure through strategic positioning.
Solution Approach 2:
The case serves as an intermediary structure that couples the diffusion unit to the overall assembly. By using the case as the mounting platform rather than directly coupling to the light emitter, the design enables easier modification of the diffusion unit without affecting the light emitter or increasing manufacturing complexity.
2Device complexity
If the diffusion unit is coupled to the light emitter, then the assembly is integrated, but SMT processes cause contamination
Solution Approach 1:
By separating the diffusion unit from the light emitter assembly and coupling it to the case, the patent creates distinct functional modules. This segmentation allows the diffusion unit to be installed separately from the SMT process used for the light emitter, thereby avoiding contamination from soldering flux and other SMT-related contaminants.
3Volume of moving object
If components are positioned close together, then the device is compact, but wire-bonding gripper collides with components
Solution Approach 1:
The diffusion unit is positioned in a different spatial dimension relative to the light emitter, coupled to the case rather than directly to the emitter. This dimensional repositioning creates sufficient clearance for wire-bonding grippers to access components without collision, while the overall device remains compact through optimized spatial arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates changes in the diffusion unit without increasing manufacturing costs, prevents contamination from SMT processes, and protects components from wire-bonding apparatus collisions, enhancing the reliability and efficiency of the camera module.
Implementation Method 1
a light emitter including a substrate and a light-emitting diode disposed on the substrate
Implementation Method 2
a diffusion unit coupled to the case and disposed on the light emitter
Implementation Method 3
a light receiver including a lens barrel and a sensor
Data Source
AI summary
An embodiment comprises: a substrate; a light emitting unit including a light emitting diode disposed on the substrate; a light receiving unit including a lens barrel and a sensor; a case housing the light emitting unit; a diffusing unit coupled to the case and disposed above the light emitting unit; a circuit substrate coupled to the substrate and the sensor; a first wire electrically connecting the light emitting unit and the substrate; and a second wire electrically connecting the substrate and the circuit substrate.