Image Sensor Depth Pixel Memory Isolation Walls

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Solution Overview

Problem

Existing image sensors that capture both 2D and depth information face challenges in alignment and integration due to the mismatched dimensions of depth and 2D image pixels, leading to misalignment and increased volume and cost when using separate sensors or integrating them within a single array.

Innovation Solution

An image sensor design that incorporates depth pixels with multiple memory zones acting as isolation walls between 2D image pixels, allowing for efficient integration and alignment of both pixel types within a single array, with each depth pixel having a detection zone and multiple memories forming partial isolation walls between adjacent 2D image pixels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate image sensors are used to capture 2D image and depth image, then both images can be captured, but misalignment between pixels occurs and volume and cost increase

Engineering Contradiction:
Improvealignment accuracyVSAvoidsensor volume
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent combines both 2D image pixels and depth pixels within a single sensor array, eliminating the need for separate sensors. This merging approach ensures that both image types are captured from the same viewpoint, preventing misalignment while reducing overall sensor volume and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sensor array is designed to perform multiple functions: capturing both 2D images and depth images simultaneously using the same physical sensor structure. This multi-functionality resolves the contradiction by allowing one sensor to replace what would traditionally require two separate sensors.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If separate image sensors are used to capture 2D image and depth image, then both images can be captured, but device cost increases

Engineering Contradiction:
Improvealignment accuracyVSAvoiddevice cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines both 2D image pixels and depth pixels within a single sensor array, eliminating the need for separate sensors. This merging approach ensures that both image types are captured from the same viewpoint, preventing misalignment while reducing overall sensor volume and cost.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If both 2D image pixels and depth pixels are integrated within a same sensor array, then alignment is improved, but integration becomes complex due to dimension mismatch

Engineering Contradiction:
Improvealignment accuracyVSAvoidintegration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent resolves the dimensionality conflict by extending memory structures vertically into the third dimension. The first, second, and third memories extend to form isolation walls between adjacent 2D image pixels, allowing depth pixels (which have larger dimensions) to be integrated with 2D pixels without increasing planar complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the sensor array into distinct pixel types (2D image pixels and depth pixels) that can be independently designed and optimized. Each pixel type has its own structure characteristics, allowing them to coexist in the same array without requiring uniform dimensions across all pixels.

Inventive Principle:
Principle #1Segmentation

4Measurement precision

If depth pixels have larger dimensions than 2D image pixels, then depth detection capability is improved, but integration with 2D pixels becomes complex

Engineering Contradiction:
Improvedepth detection capabilityVSAvoidintegration complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent resolves the dimensionality conflict by extending memory structures vertically into the third dimension. The first, second, and third memories extend to form isolation walls between adjacent 2D image pixels, allowing depth pixels (which have larger dimensions) to be integrated with 2D pixels without increasing planar complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the capture of both 2D and depth images with improved alignment and reduced size and cost, while maintaining effective charge storage and isolation between pixels, facilitating the calculation of depth information using phase shift detection of light signals.

Implementation Method 1

a doped region sandwiched between first and second parallel straight walls, the first and second walls of each memory having a conductive core adapted to receive a biasing voltage

Methodology Applied
Scientific EffectElectrostatic field: Electric Field

Data Source

PatentUS10264242B2Image sensor for capturing 2D image and depth
Publication Date: 2019.04.16 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • US10264242B2 patent drawing
  • US10264242B2 patent drawing
  • US10264242B2 patent drawing

AI summary

The invention concerns an image sensor comprising: a depth pixel (PZ) having: a detection zone (PD); a first memory (mem1) electrically coupled to the detection zone by a first gate (310); a second memory (mem2) electrically coupled to the detection zone by a second gate (314); and a third memory (mem3) electrically coupled to the detection zone by a third gate (316), wherein the first, second and third memories are each formed by a doped region sandwiched between first and second parallel straight walls (404, 406), the first and second walls of each memory having a conductive core adapted to receive a biasing voltage; and a plurality of 2D image pixels (P1 to P8) positioned adjacent to the depth pixel, wherein the first, second and third memories extend to form at least partial isolation walls between corresponding adjacent pairs of the 2D image pixels.