Desiccating Module for Downhole Tool Moisture Control

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Solution Overview

Problem

Moisture in downhole tools with electronic components reduces their reliability due to the combination of high temperature and humidity, and conventional bake-out methods are time-consuming and require expensive equipment.

Innovation Solution

A desiccating module with molecular sieve desiccants is used to adsorb moisture within the downhole tools, which can be easily installed and replaced, allowing for effective moisture control without the need for specialized equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional bake-out methods are used to remove moisture, then moisture levels are reduced, but the process becomes time-consuming and requires expensive specialized equipment

Engineering Contradiction:
Improveelectronic component reliabilityVSAvoidmoisture removal time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent extracts the moisture removal function from the complex bake-out process and concentrates it into a simple desiccant material that passively absorbs moisture through adsorption, eliminating the need for time-consuming heating processes and specialized equipment

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs disposable desiccant packets that are inexpensive, single-use components replacing expensive and time-consuming bake-out equipment, allowing rapid moisture control without investing in specialized machinery

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Reliability

If conventional bake-out methods are used to remove moisture, then moisture levels are reduced, but expensive specialized equipment is required

Engineering Contradiction:
Improveelectronic component reliabilityVSAvoidequipment complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the moisture removal function from the complex bake-out process and concentrates it into a simple desiccant material that passively absorbs moisture through adsorption, eliminating the need for time-consuming heating processes and specialized equipment

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs disposable desiccant packets that are inexpensive, single-use components replacing expensive and time-consuming bake-out equipment, allowing rapid moisture control without investing in specialized machinery

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If desiccating module is used to adsorb moisture, then moisture levels are reduced effectively, but the module requires installation and replacement procedures

Engineering Contradiction:
Improveelectronic component reliabilityVSAvoidmodule installation ease
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent divides the moisture control system into modular desiccant packets that can be independently installed and replaced, allowing easy maintenance without affecting the entire electronic assembly

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The desiccating module effectively reduces moisture levels to a predetermined threshold, enhancing the reliability and lifespan of electronic components in downhole tools, even at high temperatures up to 350 degrees Fahrenheit.

Implementation Method 1

one or more desiccants disposed in the containment portion of the housing capable of retaining moisture therein

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

The desiccant having a retention capacity sufficient to hold a predetermined threshold amount of moisture

Methodology Applied
Scientific EffectMolecular sieve: Molecular Sieve

Data Source

PatentUS11193365B2Desiccating module to reduce moisture in downhole tools
Publication Date: 2021.12.07 HALLIBURTON ENERGY SERVICES INC
  • US11193365B2 patent drawing
  • US11193365B2 patent drawing
  • US11193365B2 patent drawing

AI summary

A desiccating module configured to be installed in a downhole tool is provided. The desiccating module includes a housing having a containment portion, and desiccant located in the containment portion of the housing capable of retaining moisture therein. The housing is configured to be retained in a downhole tool containing moisture sensitive electronics. The housing is configured to permit passage of moisture from outside the housing to the containment portion and to retain the desiccant within the containment portion. The desiccant have a retention capacity sufficient to hold a predetermined threshold amount of moisture.