De-soldering Tool with Dual Heating Zones
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Solution Overview
Problem
Existing de-soldering tools face difficulties in removing multi-pin connectors from thermally dissipative printed wire boards due to increased thermal rise time, risk of damaging nearby components, and applying uniform mechanical motion during extraction.
Innovation Solution
A de-soldering tool with two heating devices that apply thermal energy via mechanical conduction to the solder junctions, supplemented by grasping clips for uniform lifting, ensuring targeted heat application and minimizing damage to surrounding components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If directed flow of heated gas is employed to melt solder on connector pins, then sufficient heat is generated to return solder to liquid state, but nearby SMT components experience rapid heating and become dislodged, damaged or removed
Solution Approach 1:
The heating element is designed with a pattern of heating zones that correspond precisely to the locations of solder joints on the connector pins. This localized heating approach concentrates thermal energy only where needed (at the solder joints) while minimizing heat exposure to nearby sensitive SMT components, thereby resolving the contradiction between achieving sufficient solder melting temperature and preventing thermal damage to nearby components
2Temperature
If pre-heating cycle is employed to melt solder, then solder is returned to liquid state, but other components or materials already soldered to the PCB incur thermal damage
Solution Approach 1:
The heating element creates localized heating zones that precisely target only the solder joints of the connector to be removed. This selective localized heating allows the solder to reach melting temperature while surrounding components and materials remain below their damage thresholds, eliminating the need for a global pre-heating cycle that would cause thermal damage to existing components
Solution Approach 2:
Instead of applying heat uniformly across the entire PCB (excessive action), the heating element applies heat only to the specific areas where solder joints need to be melted (partial action). This targeted approach achieves the necessary solder melting temperature locally without subjecting other components to damaging thermal exposure
3Ease of operation
If uniform lifting force is not applied during connector extraction, then connector leads generate torque internal to the PWB, but applying non-uniform force complicates the extraction process
Solution Approach 1:
The heating element is divided into multiple independent heating zones corresponding to different connector pin locations. Each zone can be independently controlled to melt solder at specific pins, allowing for sequential or selective melting rather than simultaneous melting of all pins. This segmentation enables more controlled extraction processes and reduces the likelihood of generating torque in the PWB during removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficiently melts solder without damaging nearby components and applies a uniform lifting force, reducing the risk of structural compromise during extraction.
Implementation Method 1
A de-soldering tool with two heating devices that apply thermal energy via mechanical conduction to the solder junctions
Data Source
AI summary
A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.